Inventor · disambiguated record
Eng Chye Chua
Also filed as: CHUA ENG CHYE
1 granted patent·1 pending application·0 citations·filing 2017–2024
6Inventor score
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2 records- 0154US2025343172A1Structure with ic die with enlarged area in scribe regionGLOBALFOUNDRIES SG PTE LTD·Filed 2024·Application pending·0 cites
- 0240US10643912B2Chip package interaction (CPI) back-end-of-line (BEOL) monitoring structure and methodGLOBALFOUNDRIES INC·Filed 2017·Granted May 5, 2020·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →