Inventor · disambiguated record
Eng Huat Goh
Also filed as: GOH ENG HUAT
70 granted patents·35 pending applications·191 citations·filing 2002–2025
98Inventor score
Top patents by PatentIndex Score
105 records- 0196US9972589B1Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layerINTEL CORP·Filed 2017·Granted May 15, 2018·47 cites·22 claims
- 0293US7642660B2Method and apparatus for reducing electrical interconnection fatigueTAY CHENG SIEW·Filed 2006·Granted Jan 5, 2010·71 cites·8 claims
- 0392US10014710B2Foldable fabric-based packaging solutionINTEL CORP·Filed 2015·Granted Jul 3, 2018·5 cites·17 claims
- 0489US2025336810A1Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2025·Application pending·0 cites
- 0588US9836095B1Microelectronic device package electromagnetic shieldINTEL CORP·Filed 2016·Granted Dec 5, 2017·6 cites·22 claims
- 0687US11205613B2Organic mold interconnects in shielded interconnects frames for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Dec 21, 2021·2 cites·23 claims
- 0786US10796999B2Floating-bridge interconnects and methods of assembling sameINTEL CORP·Filed 2019·Granted Oct 6, 2020·4 cites·18 claims
- 0884US10438882B2Integrated circuit package with microstrip routing and an external ground planeINTEL CORP·Filed 2017·Granted Oct 8, 2019·4 cites·13 claims
- 0983US12400952B2Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 1081US11538633B2Combination stiffener and capacitorINTEL CORP·Filed 2016·Granted Dec 27, 2022·3 cites·17 claims
- 1181US10856454B2Electromagnetic interference (EMI) shield for circuit card assembly (CCA)INTEL CORP·Filed 2019·Granted Dec 1, 2020·3 cites·20 claims
- 1281US10388636B2Integrating system in package (SIP) with input/output (IO) board for platform miniaturizationINTEL CORP·Filed 2015·Granted Aug 20, 2019·3 cites·25 claims
- 1381US10356902B2Board to board interconnectINTEL CORP·Filed 2015·Granted Jul 16, 2019·3 cites·10 claims
- 1480US9257368B2Microelectric package utilizing multiple bumpless build-up structures and through-silicon viasGOH ENG HUAT·Filed 2012·Granted Feb 9, 2016·7 cites·30 claims
- 1577US11908793B2Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2022·Granted Feb 20, 2024·0 cites·22 claims
- 1675US10998262B2Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2019·Granted May 4, 2021·1 cites·23 claims
- 1775US10411001B2Dynamic random access memory (DRAM) mountsINTEL CORP·Filed 2015·Granted Sep 10, 2019·2 cites·15 claims
- 1875US9613920B2Microelectronic package utilizing multiple bumpless build-up structures and through-silicon viasINTEL CORP·Filed 2015·Granted Apr 4, 2017·2 cites·20 claims
- 1973US11658111B2Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 2073US10153253B2Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatusINTEL CORP·Filed 2016·Granted Dec 11, 2018·2 cites·19 claims
- 2172US10772206B2Board to board interconnectINTEL CORP·Filed 2019·Granted Sep 8, 2020·1 cites·4 claims
- 2271US11658127B2RFI free picture frame metal stiffenerINTEL CORP·Filed 2019·Granted May 23, 2023·1 cites·28 claims
- 2369US12002793B2Integrating system in package (SiP) with input/output (IO) board for platform miniaturizationINTEL CORP·Filed 2021·Granted Jun 4, 2024·0 cites·8 claims
- 2469US11699644B2Organic mold interconnects in shielded interconnects frames for integrated-circuit packagesINTEL CORP·Filed 2021·Granted Jul 11, 2023·0 cites·16 claims
- 2569US11552403B2Slot antenna on a printed circuit board (PCB)INTEL CORP·Filed 2021·Granted Jan 10, 2023·0 cites·16 claims
- 2669US11264315B2Electronic package with passive component between substratesINTEL CORP·Filed 2017·Granted Mar 1, 2022·1 cites·11 claims
- 2769US10643983B2Extended stiffener for platform miniaturizationINTEL CORP·Filed 2018·Granted May 5, 2020·1 cites·9 claims
- 2868US12349276B2Co-planar interconnection mechanisms for circuit boardsINTEL CORP·Filed 2022·Granted Jul 1, 2025·0 cites·22 claims
- 2967US11929295B2Multi-use package architectureINTEL CORP·Filed 2022·Granted Mar 12, 2024·0 cites·14 claims
- 3067US11823994B2Systems and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate packageINTEL CORP·Filed 2022·Granted Nov 21, 2023·0 cites·16 claims
- 3167US11304299B2Board to board interconnectINTEL CORP·Filed 2020·Granted Apr 12, 2022·0 cites·24 claims
- 3267US10317938B2Apparatus utilizing computer on package constructionINTEL CORP·Filed 2015·Granted Jun 11, 2019·2 cites·22 claims
- 3367US10083922B2Inductor interconnectINTEL CORP·Filed 2016·Granted Sep 25, 2018·1 cites·22 claims
- 3466US11393760B2Floating-bridge interconnects and methods of assembling sameINTEL CORP·Filed 2020·Granted Jul 19, 2022·0 cites·19 claims
- 3565US12500155B2Electronic package with passive component between substratesINTEL CORP·Filed 2022·Granted Dec 16, 2025·0 cites·16 claims
- 3665US7795736B2Interconnects with interlocksINTEL CORP·Filed 2007·Granted Sep 14, 2010·2 cites·18 claims
- 3764US9606949B1Universal scalable system: on-the-fly system performance conversion via PC-on-a-card and USB for smart devices and IoT enablingINTEL CORP·Filed 2015·Granted Mar 28, 2017·1 cites·18 claims
- 3863US10256213B2Reduced-height electronic memory system and methodINTEL CORP·Filed 2015·Granted Apr 9, 2019·1 cites·13 claims
- 3962US2024334600A1Printed circuit boards including direct routing from integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 4061US11699664B2Wrappable EMI shieldsINTEL CORP·Filed 2020·Granted Jul 11, 2023·0 cites·15 claims
- 4160US11114421B2Integrating system in package (SiP) with input/output (IO) board for platform miniaturizationINTEL CORP·Filed 2019·Granted Sep 7, 2021·0 cites·17 claims
- 4260US7217651B2Interconnects with interlocksINTEL CORP·Filed 2004·Granted May 15, 2007·6 cites·18 claims
- 4359US10861839B2Dynamic random access memory (DRAM) mountsINTEL CORP·Filed 2019·Granted Dec 8, 2020·0 cites·12 claims
- 4459US7173342B2Method and apparatus for reducing electrical interconnection fatigueINTEL CORP·Filed 2002·Granted Feb 6, 2007·8 cites·8 claims
- 4558US10636749B2Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling sameINTEL CORP·Filed 2018·Granted Apr 28, 2020·1 cites·18 claims
- 4657US11664317B2Reverse-bridge multi-die interconnect for integrated-circuit packagesINTEL CORP·Filed 2020·Granted May 30, 2023·0 cites·19 claims
- 4755US10716209B2Fiber weave-sandwiched differential pair routing techniqueINTEL CORP·Filed 2019·Granted Jul 14, 2020·0 cites·20 claims
- 4855US2024355792A1Reversed overhang memory on package (mop) architectureINTEL CORP·Filed 2023·Application pending·0 cites
- 4954US2025113428A1Technologies for an electromagnetic interference shieldINTEL CORP·Filed 2023·Application pending·0 cites
- 5053US11211714B2Slot antenna on a printed circuit board (PCB)INTEL CORP·Filed 2017·Granted Dec 28, 2021·0 cites·4 claims
Showing the top 50 of 105 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →