Inventor · disambiguated record
Eng Sheng Peh
Also filed as: PEH ENG SHENG
19 granted patents·8 pending applications·22 citations·filing 2014–2024
90Inventor score
Top patents by PatentIndex Score
27 records- 0190US11053590B2Nozzle for uniform plasma processingAPPLIED MATERIALS INC·Filed 2019·Granted Jul 6, 2021·3 cites·10 claims
- 0287US10465288B2Nozzle for uniform plasma processingAPPLIED MATERIALS INC·Filed 2014·Granted Nov 5, 2019·4 cites·10 claims
- 0382US10446423B2Next generation warpage measurement systemAPPLIED MATERIALS INC·Filed 2017·Granted Oct 15, 2019·4 cites·20 claims
- 0479US10784134B2Image based substrate mapperAPPLIED MATERIALS INC·Filed 2018·Granted Sep 22, 2020·2 cites·18 claims
- 0579US10325790B2Methods and apparatus for correcting substrate deformityAPPLIED MATERIALS INC·Filed 2017·Granted Jun 18, 2019·3 cites·20 claims
- 0676US12437999B2Methods and apparatus for mask patterning debris removalAPPLIED MATERIALS INC·Filed 2024·Granted Oct 7, 2025·0 cites·12 claims
- 0775US10504762B2Bridging front opening unified pod (FOUP)APPLIED MATERIALS INC·Filed 2018·Granted Dec 10, 2019·2 cites·20 claims
- 0872US12463075B2Cathode assembly for integration of embedded electrostatic chuck (ESC)APPLIED MATERIALS INC·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 0968US10930542B2Apparatus for handling various sized substratesAPPLIED MATERIALS INC·Filed 2019·Granted Feb 23, 2021·1 cites·19 claims
- 1068US10566226B2Multi-cassette carrying caseAPPLIED MATERIALS INC·Filed 2015·Granted Feb 18, 2020·1 cites·16 claims
- 1166US10153187B2Methods and apparatus for transferring a substrateAPPLIED MATERIALS INC·Filed 2015·Granted Dec 11, 2018·1 cites·19 claims
- 1266US2022246476A1Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1365US9818624B2Methods and apparatus for correcting substrate deformityAPPLIED MATERIALS INC·Filed 2016·Granted Nov 14, 2017·1 cites·20 claims
- 1463US12068159B2Methods and apparatus for mask patterning debris removalAPPLIED MATERIALS INC·Filed 2021·Granted Aug 20, 2024·0 cites·8 claims
- 1563US2023187215A1Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation processAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1660US11342226B2Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch processAPPLIED MATERIALS INC·Filed 2019·Granted May 24, 2022·0 cites·12 claims
- 1760US11302549B2Substrate vacuum transport and storage apparatusAPPLIED MATERIALS INC·Filed 2019·Granted Apr 12, 2022·0 cites·19 claims
- 1856US11600492B2Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation processAPPLIED MATERIALS INC·Filed 2019·Granted Mar 7, 2023·0 cites·20 claims
- 1955US11721583B2Mainframe-less wafer transfer platform with linear transfer system for wafer processing modulesAPPLIED MATERIALS INC·Filed 2020·Granted Aug 8, 2023·0 cites·15 claims
- 2054US2025273498A1Embedded electrostatic chuck (esc)APPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2154US2019326147A1Multi-cassette carrying caseAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2251US10347516B2Substrate transfer chamberAPPLIED MATERIALS INC·Filed 2015·Granted Jul 9, 2019·0 cites·21 claims
- 2345US2022108908A1Shadow ring kit for plasma etch wafer singulation processAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2443US2015332942A1Pedestal fluid-based thermal controlPEH ENG SHENG·Filed 2014·Application pending·0 cites
- 2540US10777442B2Hybrid substrate carrierAPPLIED MATERIALS INC·Filed 2017·Granted Sep 15, 2020·0 cites·19 claims
- 2636US2019259647A1Deposition ring for processing reduced size substratesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2736US2019259635A1Process kit for processing reduced sized substratesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →