Inventor · disambiguated record
Erfeng Ding
Also filed as: Ding Erfeng
5 granted patents·12 citations·filing 2018–2019
71Inventor score
Files withGLOBALFOUNDRIES INC5
Top patents by PatentIndex Score
5 records- 0190US10423078B1FinFET cut isolation opening revision to compensate for overlay inaccuracyGLOBALFOUNDRIES INC·Filed 2019·Granted Sep 24, 2019·6 cites·11 claims
- 0283US10892222B1Anti-fuse for an integrated circuit (IC) product and method of making such an anti-fuse for an IC productGLOBALFOUNDRIES INC·Filed 2019·Granted Jan 12, 2021·4 cites·20 claims
- 0376US10324381B1FinFET cut isolation opening revision to compensate for overlay inaccuracyGLOBALFOUNDRIES INC·Filed 2018·Granted Jun 18, 2019·2 cites·4 claims
- 0452US10804170B2Device/health of line (HOL) aware eBeam based overlay (EBO OVL) structureGLOBALFOUNDRIES INC·Filed 2019·Granted Oct 13, 2020·0 cites·14 claims
- 0544US10642160B2Self-aligned quadruple patterning pitch walking solutionGLOBALFOUNDRIES INC·Filed 2018·Granted May 5, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →