Inventor · disambiguated record
Erdem Kaltalioglu
Also filed as: KALTALIOGLU ERDEM
74 granted patents·12 pending applications·877 citations·filing 2000–2023
99Inventor score
Files withIBM29INFINEON TECHNOLOGIES AG28GLOBALFOUNDRIES INC9KALTALIOGLU ERDEM5INFINEON TECHNOLOGIES CORP3
Top patents by PatentIndex Score
86 records- 0197US7201634B1Polishing methods and apparatusINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 10, 2007·48 cites·24 claims
- 0296US8159254B2Crack sensors for semiconductor devicesKALTALIOGLU ERDEM·Filed 2008·Granted Apr 17, 2012·41 cites·30 claims
- 0396US6949442B2Methods of forming MIM capacitorsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 27, 2005·112 cites·43 claims
- 0493US9768065B1Interconnect structures with variable dopant levelsGLOBALFOUNDRIES INC·Filed 2016·Granted Sep 19, 2017·10 cites·13 claims
- 0593US8610238B2Crack stop trenchesKALTALIOGLU ERDEM·Filed 2010·Granted Dec 17, 2013·13 cites·25 claims
- 0693US7871902B2Crack stop trenchesINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jan 18, 2011·19 cites·24 claims
- 0792US8890560B2Crack sensors for semiconductor devicesKALTALIOGLU ERDEM·Filed 2011·Granted Nov 18, 2014·10 cites·29 claims
- 0892US6613664B2Barbed vias for electrical and mechanical connection between conductive layers in semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2000·Granted Sep 2, 2003·95 cites·17 claims
- 0991US9059170B2Electronic fuse having a damaged regionIBM·Filed 2013·Granted Jun 16, 2015·12 cites·24 claims
- 1091US8309435B2Crack stops for semiconductor devicesKALTALIOGLU ERDEM·Filed 2011·Granted Nov 13, 2012·14 cites·20 claims
- 1191US8062971B2Dual damascene processRIESS PHILIPP·Filed 2008·Granted Nov 22, 2011·18 cites·26 claims
- 1291US6730982B2FBEOL process for Cu metallizations free from Al-wirebond padsINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 4, 2004·74 cites·16 claims
- 1390US7626268B2Support structures for semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2005·Granted Dec 1, 2009·18 cites·38 claims
- 1489US9330974B2Through level vias and methods of formation thereofKIM SUNOO·Filed 2010·Granted May 3, 2016·21 cites·26 claims
- 1589US7795615B2Capacitor integrated in a structure surrounding a dieINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 14, 2010·19 cites·25 claims
- 1689US7241681B2Bilayered metal hardmasks for use in dual damascene etch schemesIBM·Filed 2006·Granted Jul 10, 2007·13 cites·8 claims
- 1788US9305879B2E-fuse with hybrid metallizationIBM·Filed 2013·Granted Apr 5, 2016·9 cites·19 claims
- 1887US8138539B2Semiconductor devices and methods of manufacture thereofBARTH HANS-JOACHIM·Filed 2007·Granted Mar 20, 2012·14 cites·25 claims
- 1983US8889491B2Method of forming electronic fuse line with modified capIBM·Filed 2013·Granted Nov 18, 2014·5 cites·8 claims
- 2083US7060619B2Reduction of the shear stress in copper via's in organic interlayer dielectric materialINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 13, 2006·39 cites·16 claims
- 2182US9947602B2IC structure integrity sensor having interdigitated conductive elementsGLOBALFOUNDRIES INC·Filed 2016·Granted Apr 17, 2018·4 cites·19 claims
- 2282US6887783B2Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereofINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 3, 2005·26 cites·18 claims
- 2381US10770407B2IC structure with interdigitated conductive elements between metal guard structuresGLOBALFOUNDRIES INC·Filed 2019·Granted Sep 8, 2020·3 cites·19 claims
- 2481US9123726B2Selective local metal cap layer formation for improved electromigration behaviorIBM·Filed 2013·Granted Sep 1, 2015·4 cites·7 claims
- 2581US9082781B2Semiconductor article having a zig-zag guard ring and method of forming the sameIBM·Filed 2013·Granted Jul 14, 2015·5 cites·19 claims
- 2681US8093150B2Methods of manufacturing semiconductor devices and structures thereofBECK MICHAEL·Filed 2006·Granted Jan 10, 2012·9 cites·29 claims
- 2780US9478509B2Mechanically anchored backside C4 padGLOBALFOUNDRIES INC·Filed 2014·Granted Oct 25, 2016·5 cites·18 claims
- 2880US7122462B2Back end interconnect with a shaped interfaceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 17, 2006·25 cites·5 claims
- 2979US6806579B2Robust via structure and methodINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 19, 2004·29 cites·40 claims
- 3078US10297546B2Interconnect structures for a security applicationGLOBALFOUNDRIES INC·Filed 2017·Granted May 21, 2019·2 cites·11 claims
- 3178US9741657B2TSV deep trench capacitor and anti-fuse structureIBM·Filed 2014·Granted Aug 22, 2017·4 cites·15 claims
- 3278US9059166B2Interconnect with hybrid metallizationIBM·Filed 2013·Granted Jun 16, 2015·4 cites·13 claims
- 3378US8008750B2Crack stops for semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 30, 2011·7 cites·27 claims
- 3478US6278147B1On-chip decoupling capacitor with bottom hardmaskIBM·Filed 2000·Granted Aug 21, 2001·19 cites·6 claims
- 3577US9997456B2Interconnect structure having power rail structure and related methodGLOBALFOUNDRIES INC·Filed 2016·Granted Jun 12, 2018·2 cites·19 claims
- 3677US8822324B2Passivated copper chip padsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 2, 2014·3 cites·18 claims
- 3777US7615440B2Capacitor and method of manufacturing a capacitorINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 10, 2009·7 cites·21 claims
- 3876US7052621B2Bilayered metal hardmasks for use in Dual Damascene etch schemesIBM·Filed 2003·Granted May 30, 2006·15 cites·15 claims
- 3974US8748295B2Pads with different width in a scribe line region and method for manufacturing these padsKALTALIOGLU ERDEM·Filed 2009·Granted Jun 10, 2014·4 cites·30 claims
- 4074US6638851B2Dual hardmask single damascene integration scheme in an organic low k ILDINFINEON TECHNOLOGIES CORP·Filed 2001·Granted Oct 28, 2003·23 cites·15 claims
- 4173US7436016B2MIM capacitor with a cap layer over the conductive platesINFINEON TECHNOLOGIES AG·Filed 2005·Granted Oct 14, 2008·3 cites·22 claims
- 4273US7332812B2Memory card with connecting portions for connection to an adapterINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 19, 2008·5 cites·8 claims
- 4372US8906799B1Random local metal cap layer formation for improved integrated circuit reliabilityIBM·Filed 2013·Granted Dec 9, 2014·2 cites·12 claims
- 4471US6914320B2Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jul 5, 2005·13 cites·17 claims
- 4568US9852999B2Wafer reinforcement to reduce wafer curvatureIBM·Filed 2015·Granted Dec 26, 2017·1 cites·9 claims
- 4668US8378439B2Methods of manufacturing semiconductor devices and structures thereofINFINEON TECHNOLOGIES AG·Filed 2011·Granted Feb 19, 2013·2 cites·20 claims
- 4766US9059173B2Electronic fuse line with modified capIBM·Filed 2014·Granted Jun 16, 2015·1 cites·12 claims
- 4864US9059333B1Facilitating chip dicing for metal-metal bonding and hybrid wafer bondingIBM·Filed 2013·Granted Jun 16, 2015·1 cites·16 claims
- 4964US7843035B2MIM capacitors with catalytic activation layerINFINEON TECHNOLOGIES AG·Filed 2008·Granted Nov 30, 2010·1 cites·20 claims
- 5064US6387754B2Method of forming an on-chip decoupling capacitor with bottom hardmaskIBM·Filed 2001·Granted May 14, 2002·8 cites·14 claims
Showing the top 50 of 86 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →