Inventor · disambiguated record

Eric Kosters

Also filed as: KOSTERS ERIC

0 granted patents·2 pending applications·0 citations·filing 2018–2024

Technology areasC23C H10W

Files withTOKYO ELECTRON LTD1 UNIVERSAL DISPLAY CORP1

Top patents by PatentIndex Score

2 records

0159US2025308951A1Die to wafer bonding method and apparatus with thermal contactless die shape controlTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
0246US2018323373A1Capacitive sensor for positioning in ovjp printingUNIVERSAL DISPLAY CORP·Filed 2018·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when Eric Kosters files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →