Inventor · disambiguated record
Eric Lau
Also filed as: LAU ERIC · LAU ERIC L · LAU ERIC LEE
12 granted patents·18 pending applications·18 citations·filing 2014–2025
85Inventor score
Files withAPPLIED MATERIALS INC30
Top patents by PatentIndex Score
30 records- 0195US11931853B2Control of processing parameters for substrate polishing with angularly distributed zones using cost functionAPPLIED MATERIALS INC·Filed 2022·Granted Mar 19, 2024·2 cites·19 claims
- 0291US11400560B2Retaining ring designAPPLIED MATERIALS INC·Filed 2018·Granted Aug 2, 2022·6 cites·20 claims
- 0388US10589399B2Textured small pad for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Mar 17, 2020·3 cites·5 claims
- 0484US2025319568A1Control of processing parameters for substrate polishing with substrate precessionAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0579US10076817B2Orbital polishing with small padAPPLIED MATERIALS INC·Filed 2014·Granted Sep 18, 2018·3 cites·17 claims
- 0678US10256111B2Chemical mechanical polishing automated recipe generationAPPLIED MATERIALS INC·Filed 2017·Granted Apr 9, 2019·3 cites·18 claims
- 0775US11282755B2Asymmetry correction via oriented wafer loadingAPPLIED MATERIALS INC·Filed 2019·Granted Mar 22, 2022·1 cites·14 claims
- 0875US2024087965A1Asymmetry correction via oriented wafer loadingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0973US12343840B2Control of processing parameters for substrate polishing with substrate precessionAPPLIED MATERIALS INC·Filed 2022·Granted Jul 1, 2025·0 cites·17 claims
- 1072US11869815B2Asymmetry correction via oriented wafer loadingAPPLIED MATERIALS INC·Filed 2022·Granted Jan 9, 2024·0 cites·13 claims
- 1170US2024253183A1Apparatus and method for controlling substrate polish edge uniformityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1269US2025114896A1Individually rotatable platens and control of carrier head sweepAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1369US2025108473A1Polishing head with decoupled membrane position controlAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1469US2025108479A1Polishing head with flexure extending through pressure chamberAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1569US2024075584A1Retainer for chemical mechanical polishing carrier headAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1669US2025114899A1Cmp with individually rotatable platensAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1768US2025114901A1Grooves for edge and hot spot compensation in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1868US2025114898A1Retaining ring for edge compensation by slurry flow controlAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1968US2025114897A1Edge and hot spot compensation techniques in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2067US2022339755A1Retaining ring designAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2161US11764069B2Asymmetry correction via variable relative velocity of a waferAPPLIED MATERIALS INC·Filed 2021·Granted Sep 19, 2023·0 cites·18 claims
- 2261US2023356354A1Compliant inner ring for a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2360US2024033878A1Minimizing substrate bow during polishingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2458US2020282506A1Spiral and concentric movement designed for cmp location specific polish (lsp)APPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2555US10434623B2Local area polishing system and polishing pad assemblies for a polishing systemAPPLIED MATERIALS INC·Filed 2017·Granted Oct 8, 2019·0 cites·19 claims
- 2652US2023356355A1Polishing head with local inner ring downforce controlAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2751US2025316491A1Integrated substrate thinningAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2851US2018250788A1Spiral and concentric movement designed for cmp location specific polish (lsp)APPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 2940US9873179B2Carrier for small pad for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2016·Granted Jan 23, 2018·0 cites·21 claims
- 3038US10610994B2Polishing system with local area rate control and oscillation modeAPPLIED MATERIALS INC·Filed 2017·Granted Apr 7, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →