Inventor · disambiguated record
Erik Reddington
Also filed as: REDDINGTON ERIK
17 granted patents·9 pending applications·246 citations·filing 1999–2016
94Inventor score
Files withSHIPLEY CO LLC11ROHM & HAAS ELECT MAT9REDDINGTON ERIK4NIAZIMBETOVA ZUKHRA I1PENN STATE RES FOUND1
Top patents by PatentIndex Score
26 records- 0196US8268158B2Plating bath and methodNIAZIMBETOVA ZUKHRA I·Filed 2011·Granted Sep 18, 2012·20 cites·12 claims
- 0294US8048284B2Metal plating compositionsROHM & HAAS ELECT MAT·Filed 2008·Granted Nov 1, 2011·17 cites·4 claims
- 0392US6911068B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Jun 28, 2005·35 cites·23 claims
- 0490US8012334B2Metal plating compositions and methodsROHM & HAAS ELECT MAT·Filed 2008·Granted Sep 6, 2011·10 cites·3 claims
- 0590US6773573B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Aug 10, 2004·31 cites·17 claims
- 0690US6736954B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted May 18, 2004·27 cites·31 claims
- 0789US8329018B2Metal plating compositions and methodsREDDINGTON ERIK·Filed 2011·Granted Dec 11, 2012·7 cites·6 claims
- 0884US8337688B2Metal plating compositionsREDDINGTON ERIK·Filed 2011·Granted Dec 25, 2012·7 cites·5 claims
- 0983US6652731B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Nov 25, 2003·28 cites·15 claims
- 1074US6284402B1Electrocatalyst compositionsPENN STATE RES FOUND·Filed 1999·Granted Sep 4, 2001·54 cites·14 claims
- 1170US8956523B2Metal plating compositions and methodsREDDINGTON ERIK·Filed 2012·Granted Feb 17, 2015·1 cites·1 claims
- 1262US9932684B2Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxidesROHM & HAAS ELECT MAT·Filed 2016·Granted Apr 3, 2018·1 cites·8 claims
- 1362US8536049B2Method for forming metal contactsREDDINGTON ERIK·Filed 2011·Granted Sep 17, 2013·2 cites·13 claims
- 1462US7384535B2Bath analysisROHM & HAAS ELECT MAT·Filed 2004·Granted Jun 10, 2008·6 cites·8 claims
- 1556US2006081475A1Reverse pulse plating composition and methodSHIPLEY CO LLC·Filed 2005·Application pending·0 cites
- 1655US2011220512A1Plating bath and methodROHM & HAAS ELECT MAT·Filed 2010·Application pending·0 cites
- 1754US2005139118A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2004·Application pending·0 cites
- 1853US10006136B2Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compoundsROHM & HAAS ELECT MAT·Filed 2016·Granted Jun 26, 2018·0 cites·8 claims
- 1950US2004074778A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2049US2005155866A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2147US2005016858A1Reverse pulse plating composition and methodSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2243US2006151327A1Analysis methodROHM & HAAS ELECT MAT·Filed 2004·Application pending·0 cites
- 2342US2004104124A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2441US2003066756A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 2540US10100421B2Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compoundsROHM & HAAS ELECT MAT·Filed 2016·Granted Oct 16, 2018·0 cites·8 claims
- 2640US10104782B2Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxidesROHM & HAAS ELECT MAT·Filed 2016·Granted Oct 16, 2018·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →