Inventor · disambiguated record
Eric Rouya
Also filed as: ROUYA ERIC
3 granted patents·3 pending applications·0 citations·filing 2014–2023
43Inventor score
Top patents by PatentIndex Score
6 records- 0170US11434578B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2021·Granted Sep 6, 2022·0 cites·28 claims
- 0269US2024018678A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 0363US10995417B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted May 4, 2021·0 cites·20 claims
- 0448US2019390356A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 0543US2016281251A1Electrodeposition of CopperENTHONE·Filed 2014·Application pending·0 cites
- 0639US10294574B2Levelers for copper deposition in microelectronicsMACDERMID ENTHONE INC·Filed 2015·Granted May 21, 2019·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →