Inventor · disambiguated record
Eric Tan Swee Seng
Also filed as: SENG ERIC TAN SWEE
18 granted patents·1 pending application·802 citations·filing 2001–2020
95Inventor score
Top patents by PatentIndex Score
19 records- 0197US6951982B2Packaged microelectronic component assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 4, 2005·159 cites·37 claims
- 0297US6876066B2Packaged microelectronic devices and methods of forming sameMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 5, 2005·137 cites·31 claims
- 0396US6746894B2Ball grid array interposer, packages and methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 8, 2004·249 cites·56 claims
- 0495US6943450B2Packaged microelectronic devices and methods of forming sameMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 13, 2005·93 cites·15 claims
- 0594US7492039B2Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond padsMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 17, 2009·25 cites·17 claims
- 0693US7691726B2Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic componentsMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 6, 2010·27 cites·8 claims
- 0793US7259451B2Invertible microfeature device packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 21, 2007·28 cites·17 claims
- 0884US8384200B2Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assembliesMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 26, 2013·9 cites·35 claims
- 0980US7276790B2Methods of forming a multi-chip module having discrete spacersMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 2, 2007·29 cites·20 claims
- 1073US9269695B2Semiconductor device assemblies including face-to-face semiconductor dice and related methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Feb 23, 2016·2 cites·20 claims
- 1173US7528007B2Methods for assembling semiconductor devices and interposersMICRON TECHNOLOGY INC·Filed 2006·Granted May 5, 2009·5 cites·22 claims
- 1272US11101245B2Multi-chip modules including stacked semiconductor diceMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 24, 2021·0 cites·19 claims
- 1372US7218001B2Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic componentsMICRON TECHNOLOGY INC·Filed 2004·Granted May 15, 2007·15 cites·29 claims
- 1468US7274095B2Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposersMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 25, 2007·12 cites·32 claims
- 1564US7368810B2Invertible microfeature device packagesMICRON TECHNOLOGY INC·Filed 2003·Granted May 6, 2008·10 cites·25 claims
- 1660US7365424B2Microelectronic component assemblies with recessed wire bonds and methods of making sameMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 29, 2008·2 cites·10 claims
- 1753US2015303176A1Multi-chip modules including stacked semiconductor diceMICRON TECHNOLOGY INC·Filed 2015·Application pending·0 cites
- 1851US8237290B2Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond padsSENG ERIC TAN SWEE·Filed 2009·Granted Aug 7, 2012·0 cites·17 claims
- 1950US9070641B2Methods for forming assemblies and multi-chip modules including stacked semiconductor diceSENG ERIC TAN SWEE·Filed 2012·Granted Jun 30, 2015·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →