Inventor · disambiguated record
Eric W. Tremble
Also filed as: TREMBLE ERIC · TREMBLE ERIC W · TREMBLE ERIC WILLIAM
11 granted patents·4 pending applications·36 citations·filing 2004–2024
86Inventor score
Top patents by PatentIndex Score
15 records- 0180US11282806B2Partitioned substrates with interconnect bridgeMARVELL ASIA PTE LTD·Filed 2019·Granted Mar 22, 2022·3 cites·22 claims
- 0280US8312404B2Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packagesHU HAITIAN·Filed 2009·Granted Nov 13, 2012·12 cites·22 claims
- 0373US9633914B2Split ball grid array pad for multi-chip modulesIBM·Filed 2015·Granted Apr 25, 2017·2 cites·6 claims
- 0472US10714411B2Interconnected integrated circuit (IC) chip structure and packaging and method of forming sameGLOBALFOUNDRIES INC·Filed 2018·Granted Jul 14, 2020·2 cites·19 claims
- 0572US9875956B1Integrated interface structureGLOBALFOUNDRIES INC·Filed 2016·Granted Jan 23, 2018·2 cites·20 claims
- 0671US7882469B2Automatic verification of adequate conductive return-current pathsIBM·Filed 2007·Granted Feb 1, 2011·5 cites·5 claims
- 0768US2024405795A1Lateral escape using triangular structure of transceiversMARVELL ASIA PTE LTD·Filed 2024·Application pending·0 cites
- 0864US12095494B1Lateral escape using triangular structure of transceiversMARVELL ASIA PTE LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 0958US8429590B2System-level method for reducing power supply noise in an electronic systemBUDELL TIMOTHY W·Filed 2011·Granted Apr 23, 2013·1 cites·18 claims
- 1058US6945791B2Integrated circuit redistribution packageIBM·Filed 2004·Granted Sep 20, 2005·8 cites·15 claims
- 1157US2025029888A1Customized heat dissipation from different types of integrated circuit dies packaged on a common substrateMARVELL ASIA PTE LTD·Filed 2024·Application pending·0 cites
- 1255US8438520B2Early decoupling capacitor optimization method for hierarchical circuit designCARLSEN KURT A·Filed 2011·Granted May 7, 2013·1 cites·24 claims
- 1348US10483233B2Split ball grid array pad for multi-chip modulesIBM·Filed 2017·Granted Nov 19, 2019·0 cites·17 claims
- 1442US2009094564A1Method for rapid return path tracingBUDELL TIMOTHY W·Filed 2007·Application pending·0 cites
- 1540US2019363047A1Fan-out connections of processors on a panel assemblyGLOBALFOUNDRIES INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →