Inventor · disambiguated record
Eric G. Webb
Also filed as: WEBB ERIC · WEBB ERIC G
23 granted patents·1 pending application·494 citations·filing 2001–2015
97Inventor score
Top patents by PatentIndex Score
24 records- 0197US8043958B1Capping before barrier-removal IC fabrication methodNOVELLUS SYSTEMS INC·Filed 2010·Granted Oct 25, 2011·26 cites·13 claims
- 0296US8158532B2Topography reduction and control by selective accelerator removalMAYER STEVEN T·Filed 2006·Granted Apr 17, 2012·44 cites·70 claims
- 0396US7605082B1Capping before barrier-removal IC fabrication methodNOVELLUS SYSTEMS INC·Filed 2005·Granted Oct 20, 2009·36 cites·14 claims
- 0494US8372757B2Wet etching methods for copper removal and planarization in semiconductor processingNOVELLUS SYSTEMS INC·Filed 2009·Granted Feb 12, 2013·19 cites·29 claims
- 0594US7232513B1Electroplating bath containing wetting agent for defect reductionNOVELLUS SYSTEMS INC·Filed 2004·Granted Jun 19, 2007·51 cites·16 claims
- 0693US8470191B2Topography reduction and control by selective accelerator removalMAYER STEVEN T·Filed 2007·Granted Jun 25, 2013·19 cites·10 claims
- 0793US8415261B1Capping before barrier-removal IC fabrication methodREID JONATHAN D·Filed 2011·Granted Apr 9, 2013·12 cites·6 claims
- 0893US7811925B1Capping before barrier-removal IC fabrication methodNOVELLUS SYSTEMS INC·Filed 2008·Granted Oct 12, 2010·16 cites·20 claims
- 0992US7972970B2Fabrication of semiconductor interconnect structureNOVELLUS SYSTEMS INC·Filed 2007·Granted Jul 5, 2011·17 cites·24 claims
- 1092US6664122B1Electroless copper deposition method for preparing copper seed layersNOVELLUS SYSTEMS INC·Filed 2001·Granted Dec 16, 2003·61 cites·34 claims
- 1191US9074286B2Wet etching methods for copper removal and planarization in semiconductor processingNOVELLUS SYSTEMS INC·Filed 2012·Granted Jul 7, 2015·8 cites·13 claims
- 1291US8197662B1Deposit morphology of electroplated copperWEBB ERIC·Filed 2010·Granted Jun 12, 2012·20 cites·20 claims
- 1390US9447505B2Wet etching methods for copper removal and planarization in semiconductor processingNOVELLUS SYSTEMS INC·Filed 2015·Granted Sep 20, 2016·5 cites·17 claims
- 1490US7947163B2Photoresist-free metal depositionNOVELLUS SYSTEMS INC·Filed 2007·Granted May 24, 2011·9 cites·21 claims
- 1590US7690324B1Small-volume electroless plating cellNOVELLUS SYSTEMS INC·Filed 2005·Granted Apr 6, 2010·21 cites·32 claims
- 1689US8500985B2Photoresist-free metal depositionMAYER STEVEN T·Filed 2007·Granted Aug 6, 2013·8 cites·40 claims
- 1784US7879218B1Deposit morphology of electroplated copperNOVELLUS SYSTEMS INC·Filed 2003·Granted Feb 1, 2011·28 cites·14 claims
- 1883US8481432B2Fabrication of semiconductor interconnect structureMAYER STEVEN T·Filed 2011·Granted Jul 9, 2013·5 cites·20 claims
- 1977US7341946B2Methods for the electrochemical deposition of copper onto a barrier layer of a work pieceNOVELLUS SYSTEMS INC·Filed 2003·Granted Mar 11, 2008·20 cites·19 claims
- 2077US6884335B2Electroplating using DC current interruption and variable rotation rateNOVELLUS SYSTEMS INC·Filed 2003·Granted Apr 26, 2005·23 cites·57 claims
- 2176US7442267B1Anneal of ruthenium seed layer to improve copper platingNOVELLUS SYSTEMS INC·Filed 2004·Granted Oct 28, 2008·25 cites·43 claims
- 2269US7897198B1Electroless layer plating process and apparatusNOVELLUS SYSTEMS INC·Filed 2002·Granted Mar 1, 2011·16 cites·23 claims
- 2366US8257781B1Electroless plating-liquid systemWEBB ERIC G·Filed 2005·Granted Sep 4, 2012·5 cites·77 claims
- 2463US2014014522A1Photoresist-free metal depositionNOVELLUS SYSTEMS INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →