Inventor · disambiguated record
Etsuo Kiuchi
Also filed as: KIUCHI ETSUO
15 granted patents·495 citations·filing 1992–2004
95Inventor score
Top patents by PatentIndex Score
15 records- 0192US6221814B1Aqueous compositions, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluidSHINETSU HANDOTAI KK·Filed 1999·Granted Apr 24, 2001·106 cites·10 claims
- 0288US5269285AWire saw and slicing method using the sameSHINETSU HANDOTAI KK·Filed 1992·Granted Dec 14, 1993·64 cites·3 claims
- 0383US5937844AMethod for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicingSHINETSU HANDOTAI KK·Filed 1997·Granted Aug 17, 1999·47 cites·14 claims
- 0481US7513819B2Polishing apparatus and methodSHIN EISU HANDOTAI CO LTD·Filed 2004·Granted Apr 7, 2009·21 cites·8 claims
- 0581US6827638B2Polishing device and methodSHINETSU HANDOTAI KK·Filed 2001·Granted Dec 7, 2004·19 cites·9 claims
- 0681US5875769AMethod of slicing semiconductor single crystal ingotSHINETSU HANDOTAI KK·Filed 1997·Granted Mar 2, 1999·46 cites·4 claims
- 0778US6001265ARecovery of coolant and abrasive grains used in slicing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Dec 14, 1999·48 cites·14 claims
- 0863US5839425AMethod for cutting a workpiece with a wire sawSHINETSU HANDOTAI KK·Filed 1997·Granted Nov 24, 1998·21 cites·14 claims
- 0961US5715807AWire sawSHINETSU HANDOTAI KK·Filed 1996·Granted Feb 10, 1998·20 cites·20 claims
- 1060US6095129ATension adjusting mechanism for wire sawNIPPEI TOYAMA CORP·Filed 1998·Granted Aug 1, 2000·21 cites·18 claims
- 1159US5575189ARoller having grooves for wire sawSHINETSU HANDOTAI KK·Filed 1995·Granted Nov 19, 1996·20 cites·19 claims
- 1257US5927131AMethod of manufacturing wire for use in a wire saw and wire for use in a wire sawSHINETSU HANDOTAI KK·Filed 1997·Granted Jul 27, 1999·17 cites·11 claims
- 1356US5693596ACutting fluid, method for production thereof, and method for cutting ingotSHINETSU HANDOTAI KK·Filed 1995·Granted Dec 2, 1997·15 cites·8 claims
- 1455US5907988AWire saw apparatusSHINETSU HANDOTAI KK·Filed 1997·Granted Jun 1, 1999·18 cites·10 claims
- 1547US6112737AWire saw and method of cutting workNIPPEI TOYAMA CORP·Filed 1998·Granted Sep 5, 2000·12 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →