Inventor · disambiguated record
Eun-Chul Ahn
Also filed as: AHN EUN CHUL
23 granted patents·17 pending applications·209 citations·filing 1998–2024
95Inventor score
Top patents by PatentIndex Score
40 records- 0197US8736035B2Semiconductor package and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 27, 2014·26 cites·18 claims
- 0296US7915710B2Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrateSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 29, 2011·45 cites·2 claims
- 0395US8022555B2Semiconductor package and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Sep 20, 2011·34 cites·19 claims
- 0487US8421244B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2010·Granted Apr 16, 2013·7 cites·32 claims
- 0585US9123725B2Semiconductor device having fuse patternSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 1, 2015·6 cites·17 claims
- 0684US6857470B2Stacked chip package with heat transfer wiresSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 22, 2005·38 cites·20 claims
- 0780US7888785B2Semiconductor package embedded in substrate, system including the same and associated methodsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 15, 2011·11 cites·19 claims
- 0878US9484292B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2014·Granted Nov 1, 2016·3 cites·15 claims
- 0977US7626254B2Semiconductor package using chip-embedded interposer substrateSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Dec 1, 2009·9 cites·8 claims
- 1075US8354744B2Stacked semiconductor package having reduced heightSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jan 15, 2013·4 cites·20 claims
- 1169US9685400B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2016·Granted Jun 20, 2017·1 cites·20 claims
- 1269US8008771B2Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 30, 2011·4 cites·19 claims
- 1365US8922012B2Integrated circuit chip and flip chip package having the integrated circuit chipPARK JIN-WOO·Filed 2010·Granted Dec 30, 2014·2 cites·11 claims
- 1463US8367472B2Method of fabricating a 3-D deviceSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Feb 5, 2013·1 cites·12 claims
- 1562US8735281B2Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 27, 2014·1 cites·20 claims
- 1662US8129221B2Semiconductor package and method of forming the sameHWANG TAE-JOO·Filed 2011·Granted Mar 6, 2012·1 cites·10 claims
- 1762US2025079375A1Package structure and semiconductor structureCXMT CORP·Filed 2024·Application pending·0 cites
- 1861US8344497B2Semiconductor package and electronic device having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 1, 2013·2 cites·12 claims
- 1958US7821139B2Flip-chip assembly and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 26, 2010·1 cites·8 claims
- 2057US8456012B2Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the sameSHIN CHANG-WOO·Filed 2009·Granted Jun 4, 2013·2 cites·19 claims
- 2153US7923291B2Method of fabricating electronic device having stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Apr 12, 2011·0 cites·19 claims
- 2251US9449918B2Semiconductor device having fuse patternSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 20, 2016·0 cites·11 claims
- 2351US2009309206A1Semiconductor package and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2449US2008284017A1Methods of fabricating circuit board and semiconductor package, and circuit board and semiconductor package fabricated using the methodsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2548US2010237491A1Semiconductor package with reduced internal stressPARK JIN-WOO·Filed 2009·Application pending·0 cites
- 2646US2009302418A1Fuse structure of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2745US2009014876A1Wafer level stacked package having via contact in encapsulation portion and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2845US2008122081A1Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2945US2015103494A1Printed circuit boards having metal layers and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 3045US2011244634A1Semiconductor package and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
- 3144US6381838B1BGA package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted May 7, 2002·11 cites·2 claims
- 3244US2008308935A1Semiconductor chip package, semiconductor package including semiconductor chip package, and method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3343US7898075B2Semiconductor package having resin substrate with recess and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 1, 2011·0 cites·19 claims
- 3443US2008268579A1Semiconductor chip package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3543US2008258288A1Semiconductor device stack package, electronic apparatus including the same, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3643US2008265432A1Multi-chip package and method of manufacturing the multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3739US2005110128A1Highly reliable stack type semiconductor packageFiled 2004·Application pending·0 cites
- 3837US2002066949A1BGA package and method of manufacturing the sameFiled 2002·Application pending·0 cites
- 3935US2012129333A1Method for manufacturing semiconductor package and semiconductor package manufactured using the sameYIM HA-YOUNG·Filed 2011·Application pending·0 cites
- 4032US2015364387A1Wafer polishing methodCHO MOON-GI·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →