Inventor · disambiguated record
Eugen Foca
Also filed as: FOCA EUGEN
13 granted patents·17 pending applications·28 citations·filing 2009–2025
84Inventor score
Top patents by PatentIndex Score
30 records- 0189US10241421B2Vacuum system, in particular EUV lithography system, and optical elementZEISS CARL SMT GMBH·Filed 2017·Granted Mar 26, 2019·5 cites·8 claims
- 0285US8257888B2Particle beam writing method, particle beam writing apparatus and maintenance method for sameSCZYRBA MARTIN·Filed 2009·Granted Sep 4, 2012·23 cites·16 claims
- 0380US12293895B2Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methodsZEISS CARL SMT GMBH·Filed 2023·Granted May 6, 2025·0 cites·21 claims
- 0478US2025357165A1Methods of cross-section imaging of an inspection volume in a waferZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 0578US2024328970A1Method of 3d volume inspection of semiconductor wafers with increased throughputZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 0668US11810749B2Charged particle beam system, method of operating a charged particle beam system, method of recording a plurality of images and computer programs for executing the methodsZEISS CARL SMT GMBH·Filed 2021·Granted Nov 7, 2023·0 cites·33 claims
- 0768US2025239474A1Contact area size determination between 3d structures in an integrated semiconductor sampleZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 0867US12283504B2Contact area size determination between 3D structures in an integrated semiconductor sampleZEISS CARL SMT GMBH·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 0965US11915908B2Method for measuring a sample and microscope implementing the methodZEISS CARL SMT GMBH·Filed 2021·Granted Feb 27, 2024·0 cites·21 claims
- 1063US2023196189A1Measurement method and apparatus for semiconductor features with increased throughputZEISS CARL SMT GMBH·Filed 2022·Application pending·0 cites
- 1162US2025362253A13d volume inspection method and method of configuring of a 3d volume inspection methodZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 1261US2025022680A13d volume inspection of semiconductor wafers with increased throughput and accuracyZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1361US2024302304A1Electron microscope for examining a specimenZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1460US2025272946A1Sensor fusion for thin film segmentationZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 1560US2025069958A1Dual beam systems and methods for decoupling the working distance of a charged particle beam device from focused ion beam geometry induced constraintsZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1659US12288706B2Parameterizing x-ray scattering measurement using slice-and-image tomographic imaging of semiconductor structuresZEISS CARL SMT GMBH·Filed 2022·Granted Apr 29, 2025·0 cites·16 claims
- 1759US10599052B2Vacuum system, in particular EUV lithography system, and optical elementZEISS CARL SMT GMBH·Filed 2019·Granted Mar 24, 2020·0 cites·10 claims
- 1858US2024331179A13d volume inspection of semiconductor wafers with increased accuracyZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1957US2025166962A1Method for distortion measurement and parameter setting for charged particle beam imaging devices and corresponding devicesZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 2057US2024311698A1Measurement method and apparatus for semiconductor features with increased throughputZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 2156US11436506B2Method and devices for determining metrology sitesZEISS CARL SMT GMBH·Filed 2020·Granted Sep 6, 2022·0 cites·27 claims
- 2255US2025216842A1Computer implemented method for defect detection in an imaging dataset of a wafer, corresponding computer-readable medium, computer program product and systems making use of such methodsZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 2353US2023267627A1Transferring alignment information in 3d tomography from a first set of images to a second set of imagesZEISS CARL SMT GMBH·Filed 2023·Application pending·0 cites
- 2452US10585356B2Projection exposure apparatus and method for measuring a projection lensZEISS CARL SMT GMBH·Filed 2018·Granted Mar 10, 2020·0 cites·24 claims
- 2551US12288705B2FIB-SEM 3D tomography for measuring shape deviations of HAR structuresZEISS CARL SMT GMBH·Filed 2022·Granted Apr 29, 2025·0 cites·19 claims
- 2651US2024281952A13d volume inspection method and method of configuring of a 3d volume inspection methodZEISS CARL SMT GMBH·Filed 2023·Application pending·0 cites
- 2746US12045969B2Automated root cause analysis for defect detection during fabrication processes of semiconductor structuresZEISS CARL SMT GMBH·Filed 2020·Granted Jul 23, 2024·0 cites·20 claims
- 2846US2022138973A1Cross section imaging with improved 3d volume image reconstruction accuracyZEISS CARL SMT GMBH·Filed 2021·Application pending·0 cites
- 2938US9952519B2Vacuum linear feed-through and vacuum system having said vacuum linear feed-throughZEISS CARL SMT GMBH·Filed 2017·Granted Apr 24, 2018·0 cites·13 claims
- 3025US2011027699A1Reducing ion migration of absorber materials of lithography masks by chromium passivationTCHIKOULAEVA ANNA·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →