Inventor · disambiguated record
Eunsu Lee
Also filed as: LEE EUNSU
8 granted patents·23 pending applications·3 citations·filing 2019–2025
72Inventor score
Top patents by PatentIndex Score
31 records- 0193US12272661B2Semiconductor package including semiconductor chips stacked via conductive bumpsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 8, 2025·3 cites·19 claims
- 0271US2025362611A1Resist underlayer compositions and methods of forming patterns using the compositionsSAMSUNG SDI CO LTD·Filed 2025·Application pending·0 cites
- 0369US2025130493A1Resist underlayer composition and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0468US2025068076A1Resist underlayer composition and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0560US11605829B2Ion exchange membrane and energy storage device comprising sameKOLON INC·Filed 2019·Granted Mar 14, 2023·0 cites·18 claims
- 0657US2025210481A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0756US2023178782A1Polymer electrolyte membrane, manufacturing method therefor, and electrochemical device comprising sameKOLON INC·Filed 2021·Application pending·0 cites
- 0856US2025192060A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0955US2024429194A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1055US2025038080A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1155US2025348002A1Resist underlayer compositions and methods of forming patterns using the compositionsSAMSUNG SDI CO LTD·Filed 2025·Application pending·0 cites
- 1255US2025046724A1Substrate packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1355US2023253594A1Polymer electrolyte membrane and membrane-electrode assembly comprising sameKOLON INC·Filed 2021·Application pending·0 cites
- 1455US2024379481A1Semiconductor package including a plurality of chips sequentially stacked on a package substrate by an adhesive film and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1554US12166252B2Polymer electrolyte membrane, membrane-electrode assembly including same, and method for measuring durability thereofKOLON INC·Filed 2020·Granted Dec 10, 2024·0 cites·7 claims
- 1654US2024321847A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1753US12512400B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1853US2023006231A1Polymer electrolyte membrane, manufacturing method therefor, and electrochemical device comprising sameKOLON INC·Filed 2020·Application pending·0 cites
- 1953US2024096840A1Semiconductor chip, semiconductor device, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2053US2024339336A1Substrate having underfill dam and semiconductor package including the same, and method for manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2153US2025006567A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2253US2023343670A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2351US12451414B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 2451US2024203942A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2551US2023114274A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2650US2025093777A1Resist underlayer composition and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 2749US2023352460A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2848US12300004B2Vehicle path restoration system through sequential image analysis and vehicle path restoration method using the sameCARVI INC·Filed 2022·Granted May 13, 2025·0 cites·8 claims
- 2948US2023267549A1Method of predicting the future accident risk rate of the drivers using artificial intelligence and its deviceCARVI INC·Filed 2022·Application pending·0 cites
- 3040US11634124B2Method of recognizing median strip and predicting risk of collision through analysis of imageCARVI INC·Filed 2020·Granted Apr 25, 2023·0 cites·16 claims
- 3140US11562577B2Method of detecting curved lane through path estimation using monocular vision cameraCARVI INC·Filed 2021·Granted Jan 24, 2023·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →