Inventor · disambiguated record
Eugene Shalyt
Also filed as: SHALYT EUGENE
16 granted patents·13 pending applications·114 citations·filing 2002–2025
91Inventor score
Top patents by PatentIndex Score
29 records- 0191US6673226B1Voltammetric measurement of halide ion concentrationECI TECHNOLOGY·Filed 2002·Granted Jan 6, 2004·48 cites·20 claims
- 0288US8008087B1Analysis of silicon concentration in phosphoric acid etchant solutionsECI TECHNOLOGY INC·Filed 2010·Granted Aug 30, 2011·21 cites·8 claims
- 0380US7186326B2Efficient analysis of organic additives in an acid copper plating bathECI TECHNOLOGY INC·Filed 2004·Granted Mar 6, 2007·14 cites·20 claims
- 0474US7879222B2Detection of additive breakdown products in acid copper plating bathsECI TECHNOLOGY INC·Filed 2007·Granted Feb 1, 2011·4 cites·9 claims
- 0574US7291253B2Detection of an unstable additive breakdown product in a plating bathECI TECHNOLOGY INC·Filed 2004·Granted Nov 6, 2007·8 cites·26 claims
- 0674US6890758B2Measurement of complexing agent concentration in an electroless plating bathECI TECHNOLOGY INC·Filed 2003·Granted May 10, 2005·13 cites·23 claims
- 0772US8142640B2Chloride analysis in acid copper plating bathsPAVLOV MICHAEL·Filed 2007·Granted Mar 27, 2012·1 cites·19 claims
- 0868US9593931B2Palladium coating thickness measurementECI TECH INC·Filed 2013·Granted Mar 14, 2017·1 cites·27 claims
- 0965US8535504B2Analysis of an auxiliary leveler additive in an acid copper plating bathPAVLOV MICHAEL·Filed 2011·Granted Sep 17, 2013·1 cites·15 claims
- 1064US10920336B2Analysis of silver ion and complexing agent in tin-silver electrodeposition solutionECI TECH INC·Filed 2019·Granted Feb 16, 2021·0 cites·12 claims
- 1162US10590560B1Control of additive turnover in an electrodeposition solutionECI TECH INC·Filed 2018·Granted Mar 17, 2020·0 cites·11 claims
- 1262US2023332993A1Methods and process control for real time inert monitoring of acid copper electrodeposition solutionsECI TECH INC·Filed 2023·Application pending·0 cites
- 1362US2025123213A1Monitoring of hf in buffered hydrofluoric acid (bhf)KLA CORP·Filed 2024·Application pending·0 cites
- 1461US2024337628A1Quantitation of unstable reaction product or breakdown product without usage of standard chemicalECI TECH INC·Filed 2023·Application pending·0 cites
- 1560US9274079B2Etchant product analysis in alkaline etchant solutionsSHALYT EUGENE·Filed 2013·Granted Mar 1, 2016·1 cites·14 claims
- 1660US8118988B2Analysis of copper ion and complexing agent in copper plating bathsSHALYT EUGENE·Filed 2008·Granted Feb 21, 2012·2 cites·15 claims
- 1759US2024125730A1Non-reagent chloride analysis in acid copper plating bathsECI TECH INC·Filed 2023·Application pending·0 cites
- 1856US2024230608A9Selective monitoring of base chemicalsECI TECH INC·Filed 2022·Application pending·0 cites
- 1955US10407795B2Analysis of silver ion and complexing agent in tin-silver electrodeposition solutionECI TECH INC·Filed 2016·Granted Sep 10, 2019·0 cites·10 claims
- 2054US2022402772A1Non-reagent methods and process control for measuring and monitoring halide concentrations in electrodeposition solutions for iron triad metals and their alloysECI TECH INC·Filed 2022·Application pending·0 cites
- 2153US2025372410A1System and method for monitoring supercritical co2 dryingKLA CORP·Filed 2025·Application pending·0 cites
- 2251US7932094B2Method and apparatus for determining the stability of an electroless plating bathECI TECHNOLOGY INC·Filed 2008·Granted Apr 26, 2011·0 cites·12 claims
- 2351US2023042975A1Methods of boric acid analysis and process control of metallization solutionsECI TECH INC·Filed 2022·Application pending·0 cites
- 2449US2016018358A1Analysis of silicon concentration in phosphoric acid etchant solutionsECI TECHNOLOGY INC·Filed 2014·Application pending·0 cites
- 2548US2009229995A1Analysis of fluoride at low concentrations in acidic processing solutionsECI TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 2647US2018202060A1Measurement of total accelerator in an electrodeposition solutionECI TECH INC·Filed 2018·Application pending·0 cites
- 2746US2011272289A1Boric acid replenishment in electroplating bathsECI TECHNOLOGY INC·Filed 2011·Application pending·0 cites
- 2844US11555798B2Selective monitoring of multiple silicon compoundsECI TECH INC·Filed 2019·Granted Jan 17, 2023·0 cites·28 claims
- 2940US2009232448A1Fiber optic multiplexerECI TECHNOLOGY INC·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →