Inventor · disambiguated record
Feng Chen
Also filed as: CHEN FENG · CHEN FENG-CHUN
14 granted patents·21 pending applications·10 citations·filing 2006–2024
85Inventor score
Top patents by PatentIndex Score
35 records- 0193US12211743B2Method of forming a metal liner for interconnect structuresAPPLIED MATERIALS INC·Filed 2021·Granted Jan 28, 2025·3 cites·17 claims
- 0292US11764157B2Ruthenium liner and cap for back-end-of-line applicationsAPPLIED MATERIALS INC·Filed 2021·Granted Sep 19, 2023·2 cites·6 claims
- 0390US11586160B2Reducing substrate surface scratching using machine learningAPPLIED MATERIALS INC·Filed 2021·Granted Feb 21, 2023·2 cites·20 claims
- 0480US11164780B2Process integration approach for selective metal via fillAPPLIED MATERIALS INC·Filed 2019·Granted Nov 2, 2021·3 cites·15 claims
- 0575US2025029874A1Low Resistance and High Reliability Metallization ModuleAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0674US2025112090A1Method Of Forming A Metal Liner For Interconnect StructuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0773US11835927B2Reducing substrate surface scratching using machine learningAPPLIED MATERIALS INC·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 0872US2024183028A1Methods and apparatus for precleaning and treating wafer surfacesAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0969US11784127B2Ruthenium liner and cap for back-end-of-lineAPPLIED MATERIALS INC·Filed 2022·Granted Oct 10, 2023·0 cites·13 claims
- 1065US12148660B2Low resistance and high reliability metallization moduleAPPLIED MATERIALS INC·Filed 2021·Granted Nov 19, 2024·0 cites·10 claims
- 1160US12431358B2Methods and materials for enhanced barrier performance and reduced via resistanceAPPLIED MATERIALS INC·Filed 2020·Granted Sep 30, 2025·0 cites·20 claims
- 1259US12157943B2Methods of selective depositionAPPLIED MATERIALS INC·Filed 2020·Granted Dec 3, 2024·0 cites·13 claims
- 1359US11939666B2Methods and apparatus for precleaning and treating wafer surfacesAPPLIED MATERIALS INC·Filed 2020·Granted Mar 26, 2024·0 cites·15 claims
- 1458US11171046B2Methods for forming cobalt and ruthenium capping layers for interconnect structuresAPPLIED MATERIALS INC·Filed 2020·Granted Nov 9, 2021·0 cites·16 claims
- 1558US2025218867A1Selective deposition of capping layerAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1658US2025022750A1Methods of forming interconnect structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1757US2025062160A1Metal implantation to barrier or liner for interconnectAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1856US2024420966A1Copper reflow by surface modificationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1956US2024258103A1Plasma treatment of barrier and liner layersAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2055US11955382B2Reverse selective etch stop layerAPPLIED MATERIALS INC·Filed 2020·Granted Apr 9, 2024·0 cites·18 claims
- 2155US2024071927A1Tantalum doped ruthenium layers for interconnectsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2255US2020347493A1Reverse Selective DepositionAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2354US2024420997A1Selective liner deposition for via resistance reductionAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2453US2023253248A1Methods of forming metal liner for interconnect structuresAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2553US2024321633A1Ultra-thin layers by selective passivationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2653US2024290655A1Selective via-fill with conformal sidewall coverageAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2752US2024339358A1Method of forming a metal liner for interconnect structuresAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2852US2024006235A1Composite barrier layersAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2951US2024153816A1Methods to form metal liners for interconnectsAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3049US11527437B2Methods and apparatus for intermixing layer for enhanced metal reflowAPPLIED MATERIALS INC·Filed 2020·Granted Dec 13, 2022·0 cites·10 claims
- 3148US11587873B2Binary metal liner layersAPPLIED MATERIALS INC·Filed 2020·Granted Feb 21, 2023·0 cites·16 claims
- 3246US2022037204A1Methods and apparatus for forming stabilization layersAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3346US2021062330A1Selective cobalt deposition on copper surfacesAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3442US2008076241A1Method for reducing stress between a conductive layer and a mask layer and use of the samePROMOS TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 3538US2015294843A1Methods for extending chamber component life for plasma processing semiconductor applicationsAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →