Inventor · disambiguated record
Feng-Yu Hsu
Also filed as: HSU FENG-YU
3 granted patents·6 pending applications·13 citations·filing 2005–2012
65Inventor score
Top patents by PatentIndex Score
9 records- 0174US8084357B2Method for manufacturing a dual damascene opening comprising a trench opening and a via openingCHEN WEI-CHIH·Filed 2007·Granted Dec 27, 2011·5 cites·8 claims
- 0273US7439154B2Method of fabricating interconnect structureUNITED MICROELECTRONICS CORP·Filed 2006·Granted Oct 21, 2008·6 cites·9 claims
- 0360US7514347B2Interconnect structure and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2006·Granted Apr 7, 2009·2 cites·16 claims
- 0449US2009146311A1Interconnect structureUNITED MICROELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 0546US2014137469A1Tube structure for preserving a flowerLIN JUI-CHENG·Filed 2012·Application pending·0 cites
- 0645US2009283310A1Multi cap layer and manufacturing method thereofCHEN WEI-CHIH·Filed 2009·Application pending·0 cites
- 0741US2007085208A1Interconnect structureHSU FENG-YU·Filed 2005·Application pending·0 cites
- 0837US2006199367A1Semiconductor device and manufacturing method thereofHUANG JIM-JEY·Filed 2005·Application pending·0 cites
- 0935US2006199386A1Semiconductor device with low-resistance inlaid copper/barrier interconnects and method for manufacturing the sameHUANG JIM-JEY·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Feng-Yu Hsu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →