Inventor · disambiguated record
Feng-Ming Huang
Also filed as: HUANG FENG-MING
11 granted patents·2 pending applications·5 citations·filing 2017–2023
82Inventor score
Top patents by PatentIndex Score
13 records- 0182US12272646B2Semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Apr 8, 2025·0 cites·8 claims
- 0276US10381306B2Semiconductor memory device and a manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 13, 2019·1 cites·4 claims
- 0375US11769727B2Semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 26, 2023·0 cites·13 claims
- 0473US10062700B2Semiconductor storage device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·2 cites·11 claims
- 0569US10263001B2Method of forming semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 16, 2019·1 cites·11 claims
- 0669US2023261046A1Method of forming semiconductor structureFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Application pending·0 cites
- 0768US11164877B2Semiconductor device having void in bit line contact plugFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2019·Granted Nov 2, 2021·1 cites·10 claims
- 0867US11688764B2Semiconductor structure and method of forming sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·19 claims
- 0967US11678479B2Method of fabricating semiconductor device having void in bit line contact plugFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·16 claims
- 1065US11139243B2Semiconductor memory deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 5, 2021·0 cites·4 claims
- 1158US11145715B2Semiconductor structure and method of forming sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2019·Granted Oct 12, 2021·0 cites·19 claims
- 1246US10204914B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 12, 2019·0 cites·8 claims
- 1337US2019204748A1Method for removing patterned negative photoresistUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →