Inventor · disambiguated record
Felix C. Li
Also filed as: LI FELIX · LI FELIX C
19 granted patents·2 pending applications·330 citations·filing 2002–2025
94Inventor score
Top patents by PatentIndex Score
21 records- 0196US7564130B1Power micro surface-mount device packageNAT SEMICONDUCTOR CORP·Filed 2007·Granted Jul 21, 2009·61 cites·16 claims
- 0295US6872599B1Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)NAT SEMICONDUCTOR CORP·Filed 2002·Granted Mar 29, 2005·94 cites·13 claims
- 0394US7023074B2Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)NAT SEMICONDUCTOR CORP·Filed 2005·Granted Apr 4, 2006·32 cites·6 claims
- 0492US6781243B1Leadless leadframe package substitute and stack packageNAT SEMICONDUCTOR CORP·Filed 2003·Granted Aug 24, 2004·67 cites·25 claims
- 0585US8097934B1Delamination resistant device package having low moisture sensitivityLI FELIX C·Filed 2008·Granted Jan 17, 2012·16 cites·42 claims
- 0685US7109587B1Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devicesNAT SEMICONDUCTOR CORP·Filed 2004·Granted Sep 19, 2006·30 cites·15 claims
- 0780US2025390502A1Methods and system for detecting unmanaged resources in cloud-based data warehousing systemCAPITAL ONE SERVICES LLC·Filed 2025·Application pending·0 cites
- 0873US12430352B2Methods and system for detecting unmanaged resources in cloud-based data warehousing systemCAPITAL ONE SERVICES LLC·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 0968US7456503B1Integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2007·Granted Nov 25, 2008·4 cites·20 claims
- 1066US12019648B2Methods and system for detecting unmanaged resources in cloud-based data warehousing systemCAPITAL ONE SERVICES LLC·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 1165US8736042B2Delamination resistant device package having raised bond surface and mold locking apertureLI FELIX C·Filed 2011·Granted May 27, 2014·2 cites·15 claims
- 1263US7425503B1Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devicesNAT SEMICONDUCTOR CORP·Filed 2006·Granted Sep 16, 2008·1 cites·6 claims
- 1362US7812463B2Packaging integrated circuits for high stress environmentsNAT SEMICONDUCTOR CORP·Filed 2008·Granted Oct 12, 2010·2 cites·17 claims
- 1461US7005728B1Lead configuration for inline packagesNAT SEMICONDUCTOR CORP·Filed 2004·Granted Feb 28, 2006·10 cites·18 claims
- 1560US12189645B2Methods and systems for generating recommendations in cloud-based data warehousing systemCAPITAL ONE SERVICES LLC·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 1660US6956291B1Apparatus and method for forming solder seals for semiconductor flip chip packagesNAT SEMICONDUCTOR CORP·Filed 2003·Granted Oct 18, 2005·8 cites·7 claims
- 1759US12147687B2System and method for dynamic cloud-based storage system deploymentDELL PRODUCTS LP·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 1850US7432583B2Leadless leadframe package substitute and stack packageNAT SEMICONDUCTOR CORP·Filed 2004·Granted Oct 7, 2008·3 cites·12 claims
- 1947US7479411B1Apparatus and method for forming solder seals for semiconductor flip chip packagesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Jan 20, 2009·0 cites·11 claims
- 2044US7898088B2I/O pad structures for integrated circuit devicesNAT SEMICONDUCTOR CORP·Filed 2007·Granted Mar 1, 2011·0 cites·18 claims
- 2140US2008061408A1Integrated circuit packageNAT SEMICONDUCTOR CORP·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →