Inventor · disambiguated record
Feng-Chang Tu
Also filed as: TU FENG-CHANG
5 granted patents·3 pending applications·32 citations·filing 2000–2002
78Inventor score
Files withORIENT SEMICONDUCTOR ELECT LTD5
Top patents by PatentIndex Score
8 records- 0159US6499648B2Method and device for making a metal bump with an increased heightORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted Dec 31, 2002·9 cites·1 claims
- 0252US6390356B1Method of forming cylindrical bumps on a substrate for integrated circuitsORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted May 21, 2002·5 cites·1 claims
- 0351US6567270B2Semiconductor chip package with cooling arrangementORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted May 20, 2003·6 cites·1 claims
- 0451US6358834B1Method of forming bumps on wafers or substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Mar 19, 2002·6 cites·2 claims
- 0549US6274491B1Process of manufacturing thin ball grid array substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Aug 14, 2001·6 cites·1 claims
- 0634US2003059721A1Fabrication method of semiconductorFiled 2002·Application pending·0 cites
- 0734US2003006268A1Method and device for making a metal bump with an increased heightFiled 2001·Application pending·0 cites
- 0831US2002072216A1Manufacturing method for multilayer high density substrateFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →