Inventor · disambiguated record
Fengyan Wei
Also filed as: WEI FENGYAN
0 granted patents·5 pending applications·0 citations·filing 2022–2023
Technology areasH10P
Files withLAM RES CORP5
Top patents by PatentIndex Score
5 records- 0155US2025069882A1Silicon nitride depositionLAM RES CORP·Filed 2022·Application pending·0 cites
- 0255US2024410053A1Conformal silicon oxide deposition using aminosilane and chlorosilane precursorsLAM RES CORP·Filed 2022·Application pending·0 cites
- 0354US2025285858A1Single wafer reactor, low temperature, thermal silicon nitride depositionLAM RES CORP·Filed 2023·Application pending·0 cites
- 0453US2025014890A1Conformal, carbon-doped silicon nitride films and methods thereofLAM RES CORP·Filed 2022·Application pending·0 cites
- 0551US2024387226A1Remote plasma deposition with electrostatic clampingLAM RES CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →