Inventor · disambiguated record
Fong-Yuan Chang
Also filed as: CHANG FONG-YUAN
135 granted patents·41 pending applications·202 citations·filing 2001–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD162CHANG FONG-YUAN5SYNOPSYS TAIWAN CO LTD3SYNOPSYS INC2CHIOU JIN-CHERN1
Top patents by PatentIndex Score
176 records- 0198US11437708B2Antenna effect protection and electrostatic discharge protection for three-dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 6, 2022·11 cites·20 claims
- 0297US11967591B2Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 23, 2024·4 cites·20 claims
- 0397US11861282B2Integrated circuit fin structure manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 2, 2024·2 cites·20 claims
- 0497US10878165B2Method for generating layout diagram including protruding pin cell regions and semiconductor device based on sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·10 cites·20 claims
- 0595US11824254B2Antenna effect protection and electrostatic discharge protection for three-dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·2 cites·20 claims
- 0695US11658157B2Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·2 cites·20 claims
- 0794US12002776B2Interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·2 cites·20 claims
- 0894US11817139B2Memory device having bitline segmented into bitline segments and related method for operating memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0994US11636249B2Integrated circuit and layout method for standard cell structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·2 cites·20 claims
- 1093US11842946B2Semiconductor package having an encapsulant comprising conductive fillers and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·2 cites·20 claims
- 1193US11030372B2Method for generating layout diagram including cell having pin patterns and semiconductor device based on sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·6 cites·20 claims
- 1293US10535635B2Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·6 cites·20 claims
- 1392US10521545B2Placement constraint method for multiple patterning of cell-based chip designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 31, 2019·4 cites·20 claims
- 1492US10262981B2Integrated circuit, system for and method of forming an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 16, 2019·7 cites·20 claims
- 1591US11281836B2Cell structures and semiconductor devices having sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 22, 2022·2 cites·20 claims
- 1691US11222884B2Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 11, 2022·5 cites·20 claims
- 1791US10664565B2Method and system of expanding set of standard cells which comprise a libraryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·5 cites·20 claims
- 1891US10552568B2Method of modifying cell and global connection routing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 4, 2020·6 cites·20 claims
- 1990US11387177B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 12, 2022·8 cites·20 claims
- 2090US11080453B2Integrated circuit fin layout method, system, and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·3 cites·20 claims
- 2190US10157840B2Integrated circuit having a high cell densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·5 cites·20 claims
- 2289US11756951B2Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·1 cites·20 claims
- 2389US11088084B2Electromagnetic shielding metal-insulator-metal capacitor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 10, 2021·2 cites·20 claims
- 2489US11037920B2Pin modification for standard cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 15, 2021·2 cites·20 claims
- 2589US10559558B2Pin modification for standard cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 11, 2020·4 cites·20 claims
- 2688US11532533B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·2 cites·20 claims
- 2788US11532580B2Interconnect structure, semiconductor structure including interconnect structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·2 cites·20 claims
- 2888US11043473B2Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·3 cites·20 claims
- 2988US10396063B2Circuit with combined cells and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 27, 2019·7 cites·8 claims
- 3088US10268796B2Method and system for pin layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·5 cites·20 claims
- 3187US11574107B2Method for manufacturing a cell having pins and semiconductor device based on sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 7, 2023·1 cites·20 claims
- 3287US10777505B2Method of fabricating integrated circuit having staggered conductive featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 15, 2020·4 cites·20 claims
- 3387US10741539B2Standard cells and variations thereof within a standard cell libraryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 11, 2020·4 cites·18 claims
- 3487US2025078890A1Memory device having bitline segmented into bitline segments and related method for operating memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3586US12321680B2Integrated circuit fin structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 3686US12176016B2Memory device having bitline segmented into bitline segments and related method for operating memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 3786US11637098B2Pin modification for standard cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·1 cites·20 claims
- 3886US10903239B2Integrated circuit device with improved layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 26, 2021·4 cites·18 claims
- 3986US10402534B2Integrated circuit layout methods, structures, and systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 3, 2019·3 cites·20 claims
- 4086US2025291996A1Integrated circuit fin structure manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4186US2024387373A1Integrated Circuit Having a High Cell DensityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4286US2024370633A1Integrated circuit manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4385US10977418B2Semiconductor device with cell region, method of generating layout diagram and system for sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·3 cites·20 claims
- 4485US2025349717A1Semiconductor device including parallel configurationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4584US12079561B2Cell region including portion of conductor of another cell region and semiconductor device include the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 4684US2024413052A1Heat Dissipation StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4784US2025322140A1Semiconductor device with cell regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4883US12154842B2Heat dissipation structures for three-dimensional system on integrated chip structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 4983US11094608B2Heat dissipation structure including stacked chips surrounded by thermal interface material ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 5083US8782588B2Multiple level spine routingSYNOPSYS TAIWAN CO LTD·Filed 2013·Granted Jul 15, 2014·6 cites·25 claims
Showing the top 50 of 176 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →