Inventor · disambiguated record
Frank Burmeister
Also filed as: BURMEISTER FRANK
8 granted patents·4 pending applications·31 citations·filing 1999–2024
78Inventor score
Top patents by PatentIndex Score
12 records- 0171US9806034B1Semiconductor device with protected sidewalls and methods of manufacturing thereofNexperia BV·Filed 2016·Granted Oct 31, 2017·2 cites·17 claims
- 0257US6391679B1Method of processing a single semiconductor using at least one carrier elementPHILIPS CORP·Filed 1999·Granted May 21, 2002·28 cites·17 claims
- 0355US2008223295A1METHOD FOR PRODUCING A TOOL WHICH CAN BE USED TO CREATE OPTICALLY ACTIVE SURFACE STRUCTRES IN THE SUB-nuM RANGE AND A CORRESPONDING TOOLFRAUNHOFER GES FORSCHUNG·Filed 2008·Application pending·0 cites
- 0455US2024387423A1Bond pad design for semiconductor device packagesNexperia BV·Filed 2024·Application pending·0 cites
- 0550US12463055B2Package substrate manufacturing methodZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·10 claims
- 0649US7390531B2Method for producing a tool which can be used to create surface structures in the sub-μm rangeFRAUNHOFER GES FORSCHUNG·Filed 2001·Granted Jun 24, 2008·1 cites·12 claims
- 0747US12476220B2Substrate-based package semiconductor device with side wettable flanksNexperia BV·Filed 2022·Granted Nov 18, 2025·0 cites·18 claims
- 0847US2023223325A1Semiconductor package substrate made from non-metallic material and a method of manufacturing thereofNexperia BV·Filed 2023·Application pending·0 cites
- 0943US11342357B2Semiconductor deviceNexperia BV·Filed 2019·Granted May 24, 2022·0 cites·14 claims
- 1042US9859184B2Method of making a plurality of semiconductor devicesNexperia BV·Filed 2016·Granted Jan 2, 2018·0 cites·10 claims
- 1134US2017256432A1Overmolded chip scale packageNexperia BV·Filed 2016·Application pending·0 cites
- 1233US10546816B2Semiconductor substrate with electrically isolating dielectric partitionNexperia BV·Filed 2016·Granted Jan 28, 2020·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →