Inventor · disambiguated record
Fred Fishburn
Also filed as: FISHBURN FRED · FISHBURN FRED D
76 granted patents·9 pending applications·1,334 citations·filing 1992–2022
99Inventor score
Files withMICRON TECHNOLOGY INC67APPLIED MATERIALS INC4VAIYAPURI VENKATESHWARAN3TEXAS INSTRUMENTS INC2WANG HONGMEI2
Top patents by PatentIndex Score
85 records- 0199US10607995B2Memory arraysMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 31, 2020·84 cites·34 claims
- 0297US7384847B2Methods of forming DRAM arraysMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 10, 2008·31 cites·21 claims
- 0396US11380691B1CMOS over array of 3-D DRAM deviceAPPLIED MATERIALS INC·Filed 2021·Granted Jul 5, 2022·3 cites·20 claims
- 0496US7538036B2Methods of forming openings, and methods of forming container capacitorsMICRON TECHNOLOGY INC·Filed 2005·Granted May 26, 2009·36 cites·8 claims
- 0596US7517754B2Methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2008·Granted Apr 14, 2009·44 cites·19 claims
- 0696US7335935B2Semiconductor structuresMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 26, 2008·32 cites·15 claims
- 0796US7321149B2Capacitor structures, and DRAM arraysMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 22, 2008·34 cites·7 claims
- 0895US7638392B2Methods of forming capacitor structuresMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 29, 2009·23 cites·25 claims
- 0995US7445990B2Methods of forming a plurality of capacitorsMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 4, 2008·30 cites·38 claims
- 1095US7413952B2Methods of forming a plurality of circuit components and methods of forming a plurality of structures suspended elevationally above a substrateMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 19, 2008·54 cites·30 claims
- 1195US7341909B2Methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 11, 2008·37 cites·22 claims
- 1295US7321150B2Semiconductor device precursor structures to a double-sided capacitor or a contactMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 22, 2008·39 cites·5 claims
- 1395US7288806B2DRAM arraysMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 30, 2007·21 cites·22 claims
- 1495US7268039B2Method of forming a contact using a sacrificial structureMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 11, 2007·40 cites·9 claims
- 1595US7202127B2Methods of forming a plurality of capacitorsMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 10, 2007·122 cites·28 claims
- 1694US7759193B2Methods of forming a plurality of capacitorsMICRON TECHNOLOGY INC·Filed 2008·Granted Jul 20, 2010·25 cites·35 claims
- 1794US7273779B2Method of forming a double-sided capacitorMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 25, 2007·31 cites·19 claims
- 1892US6372574B1Method of forming a capacitor container electrode and method of patterning a metal layer by selectively silicizing the electrode or metal layer and removing the silicized portionMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 16, 2002·65 cites·74 claims
- 1990US6707088B2Method of forming integrated circuitry, method of forming a capacitor, method of forming DRAM integrated circuitry and DRAM integrated categoryMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 16, 2004·49 cites·20 claims
- 2089US7271086B2Microfeature workpieces and methods of forming a redistribution layer on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 18, 2007·18 cites·31 claims
- 2189US7153778B2Methods of forming openings, and methods of forming container capacitorsMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 26, 2006·34 cites·29 claims
- 2289US7005379B2Semiconductor processing methods for forming electrical contactsMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 28, 2006·37 cites·21 claims
- 2389US6787833B1Integrated circuit having a barrier structureMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 7, 2004·40 cites·27 claims
- 2488US7935602B2Semiconductor processing methodsMICRON TECHNOLOGY INC·Filed 2005·Granted May 3, 2011·15 cites·14 claims
- 2588US7279379B2Methods of forming memory arrays; and methods of forming contacts to bitlinesMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 9, 2007·24 cites·55 claims
- 2688US6475855B1Method of forming integrated circuitry, method of forming a capacitor and method of forming DRAM integrated circuitryMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 5, 2002·39 cites·40 claims
- 2787US7205227B2Methods of forming CMOS constructionsMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 17, 2007·9 cites·33 claims
- 2887US7071055B2Method of forming a contact structure including a vertical barrier structure and two barrier layersMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 4, 2006·32 cites·19 claims
- 2986US7442600B2Methods of forming threshold voltage implant regionsMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 28, 2008·23 cites·11 claims
- 3086US6962846B2Methods of forming a double-sided capacitor or a contact using a sacrificial structureMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 8, 2005·34 cites·20 claims
- 3185US10418182B2Apparatuses, multi-chip modules and capacitive chipsMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 17, 2019·2 cites·14 claims
- 3284US8163613B2Methods of forming a plurality of capacitorsFISHBURN FRED D·Filed 2010·Granted Apr 24, 2012·9 cites·31 claims
- 3384US7135401B2Methods of forming electrical connections for semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 14, 2006·16 cites·50 claims
- 3484US7084004B2MEMS heat pumps for integrated circuit heat dissipationMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 1, 2006·23 cites·12 claims
- 3580US7186642B2Low temperature nitride used as Cu barrier layerMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 6, 2007·5 cites·10 claims
- 3680US7107777B2MEMS heat pumps for integrated circuit heat dissipationMICRO TECHNOLOGY INC·Filed 2003·Granted Sep 19, 2006·17 cites·8 claims
- 3780US6613671B1Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed therebyMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 2, 2003·19 cites·31 claims
- 3880US6492267B1Low temperature nitride used as Cu barrier layerMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 10, 2002·19 cites·12 claims
- 3978US8580666B2Methods of forming conductive contactsMCDANIEL TERRENCE·Filed 2011·Granted Nov 12, 2013·4 cites·16 claims
- 4078US7440255B2Capacitor constructions and methods of formingMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 21, 2008·20 cites·56 claims
- 4177US7569453B2Contact structureMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 4, 2009·5 cites·14 claims
- 4276US7473644B2Method for forming controlled geometry hardmasks including subresolution elementsMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 6, 2009·15 cites·46 claims
- 4371US8687426B2Multi-semiconductor material vertical memory strings, strings of memory cells having individually biasable channel regions, memory arrays incorporating such strings, and methods of accesssing and forming the sameMICRON TECHNOLOGY INC·Filed 2013·Granted Apr 1, 2014·3 cites·26 claims
- 4470US7659161B2Methods of forming storage nodes for a DRAM arrayMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 9, 2010·2 cites·19 claims
- 4570US7329607B2Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed therebyMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 12, 2008·10 cites·10 claims
- 4669US11980021B2CMOS over array of 3-D DRAM deviceAPPLIED MATERIALS INC·Filed 2022·Granted May 7, 2024·0 cites·15 claims
- 4769USRE49715EMemory arraysMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 24, 2023·0 cites·34 claims
- 4869US8395941B2Multi-semiconductor material vertical memory strings, strings of memory cells having individually biasable channel regions, memory arrays incorporating such strings, and methods of accessing and forming the sameFISHBURN FRED·Filed 2010·Granted Mar 12, 2013·4 cites·40 claims
- 4967US10685785B2Apparatuses, multi-chip modules and capacitive chipsMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 16, 2020·0 cites·19 claims
- 5067US7713817B2Methods of forming semiconductor structuresMICRON TECHNOLOGY INC·Filed 2008·Granted May 11, 2010·2 cites·5 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →