Inventor · disambiguated record
Frank Hoffmann
Also filed as: HOFFMANN FRANK · HOFFMANN FRANK H
5 granted patents·4 pending applications·45 citations·filing 1981–2021
78Inventor score
Files withINFINEON TECHNOLOGIES AG4BAHLSEN GMBH & CO KG1INFINEON TECH DRESDEN GMBH & CO KG1KAUTZSCH THORALF1KLARNA AB1
Top patents by PatentIndex Score
9 records- 0190US8481400B2Semiconductor manufacturing and semiconductor device with semiconductor structureKAUTZSCH THORALF·Filed 2010·Granted Jul 9, 2013·9 cites·9 claims
- 0276US7812966B2Method of determining the depth profile of a surface structure and system for determining the depth profile of a surface structureINFINEON TECHNOLOGIES AG·Filed 2007·Granted Oct 12, 2010·15 cites·19 claims
- 0375US9812369B2BiMOS device with a fully self-aligned emitter-silicon and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted Nov 7, 2017·2 cites·25 claims
- 0458US4378572ACamera interfacePROFESSIONAL PRODUCTS INC·Filed 1981·Granted Mar 29, 1983·19 cites·6 claims
- 0555US2015201641A1Long-life bakery product and method for the production thereofBAHLSEN GMBH & CO KG·Filed 2013·Application pending·0 cites
- 0651US10312159B2BiMOS device with a fully self-aligned emitter-silicon and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 4, 2019·0 cites·9 claims
- 0745US2017032352A1Integration of extended computer system functionalityKLARNA AB·Filed 2015·Application pending·0 cites
- 0844US2022028727A1Semiconductor device manufacturing by thinning and dicingINFINEON TECH DRESDEN GMBH & CO KG·Filed 2021·Application pending·0 cites
- 0941US2014151854A1Method for Separating a Layer and a Chip Formed on a LayerINFINEON TECHNOLOGIES AG·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Frank Hoffmann files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →