Inventor · disambiguated record
Francis Heap Hoe Kuan
Also filed as: KUAN FRANCIS HEAP HOE
7 granted patents·36 citations·filing 2006–2011
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0186US7901956B2Structure for bumped wafer testSTATS CHIPPAC LTD·Filed 2006·Granted Mar 8, 2011·18 cites·22 claims
- 0283US7495321B2Leaded stacked packages having elevated die paddleSTATS CHIPPAC LTD·Filed 2006·Granted Feb 24, 2009·10 cites·21 claims
- 0370US7622811B2Semiconductor assembly with component attached on die back sideSTATS CHIPPAC INC·Filed 2006·Granted Nov 24, 2009·4 cites·16 claims
- 0459US8203145B2Structure for bumped wafer testKUAN FRANCIS HEAP HOE·Filed 2011·Granted Jun 19, 2012·2 cites·27 claims
- 0559US7858442B2Leaded stacked packages having elevated die paddleSTATS CHIPPAC LTD·Filed 2009·Granted Dec 28, 2010·1 cites·21 claims
- 0658US7667308B2Leaded stacked packages having integrated upper leadSTATS CHIPPAC LTD·Filed 2006·Granted Feb 23, 2010·1 cites·14 claims
- 0754US7952211B2Semiconductor assembly with component pads attached on die back sideSTATS CHIPPAC INC·Filed 2009·Granted May 31, 2011·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Francis Heap Hoe Kuan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →