Inventor · disambiguated record
Frank Lambrecht
Also filed as: LAMBRECHT FRANK · LAMBRECHT FRANK PETER
41 granted patents·5 pending applications·1,174 citations·filing 1999–2023
98Inventor score
Top patents by PatentIndex Score
46 records- 0199US8670261B2Stub minimization using duplicate sets of signal terminalsINVENSAS CORP·Filed 2013·Granted Mar 11, 2014·78 cites·28 claims
- 0299US8405207B1Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Mar 26, 2013·42 cites·30 claims
- 0399US8345441B1Stub minimization for multi-die wirebond assemblies with parallel windowsINVENSAS CORP·Filed 2011·Granted Jan 1, 2013·70 cites·30 claims
- 0498US8659141B2Stub minimization using duplicate sets of terminals for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·37 cites·30 claims
- 0598US8659142B2Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·31 cites·30 claims
- 0698US8659143B2Stub minimization for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·32 cites·30 claims
- 0798US8653646B2Stub minimization using duplicate sets of terminals for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Feb 18, 2014·31 cites·30 claims
- 0898US8513813B2Stub minimization using duplicate sets of terminals for wirebond assemblies without windowsCRISP RICHARD DEWITT·Filed 2012·Granted Aug 20, 2013·39 cites·30 claims
- 0998US8441111B2Stub minimization for multi-die wirebond assemblies with parallel windowsCRISP RICHARD DEWITT·Filed 2012·Granted May 14, 2013·49 cites·30 claims
- 1098US8436457B2Stub minimization for multi-die wirebond assemblies with parallel windowsCRISP RICHARD DEWITT·Filed 2011·Granted May 7, 2013·45 cites·30 claims
- 1198US8436477B2Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted May 7, 2013·48 cites·30 claims
- 1298US8254155B1Stub minimization for multi-die wirebond assemblies with orthogonal windowsCRISP RICHARD DEWITT·Filed 2012·Granted Aug 28, 2012·68 cites·30 claims
- 1397US8659139B2Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·32 cites·30 claims
- 1497US8659140B2Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Feb 25, 2014·31 cites·30 claims
- 1597US8629545B2Stub minimization for assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Jan 14, 2014·32 cites·28 claims
- 1697US8610260B2Stub minimization for assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Dec 17, 2013·35 cites·31 claims
- 1797US8525327B2Stub minimization for assemblies without wirebonds to package substrateCRISP RICHARD DEWITT·Filed 2012·Granted Sep 3, 2013·33 cites·30 claims
- 1897US8278764B1Stub minimization for multi-die wirebond assemblies with orthogonal windowsCRISP RICHARD DEWITT·Filed 2012·Granted Oct 2, 2012·36 cites·30 claims
- 1996US8981547B2Stub minimization for multi-die wirebond assemblies with parallel windowsINVENSAS CORP·Filed 2014·Granted Mar 17, 2015·24 cites·20 claims
- 2095US11950358B1Integrated circuit package with voltage droop mitigationXILINX INC·Filed 2021·Granted Apr 2, 2024·3 cites·20 claims
- 2192US9013033B2Multiple die face-down stacking for two or more dieTESSERA INC·Filed 2013·Granted Apr 21, 2015·12 cites·43 claims
- 2292US8743052B1Computing interface systemKELLER ERIC JEFFREY·Filed 2013·Granted Jun 3, 2014·352 cites·16 claims
- 2391US11688675B1Core cavity noise isolation structure for use in chip packagesXILINX INC·Filed 2021·Granted Jun 27, 2023·2 cites·17 claims
- 2485US9679838B2Stub minimization for assemblies without wirebonds to package substrateINVENSAS CORP·Filed 2016·Granted Jun 13, 2017·3 cites·20 claims
- 2577US9377824B2Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windowsINVENSAS CORP·Filed 2014·Granted Jun 28, 2016·2 cites·13 claims
- 2673US9679876B2Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each otherINVENSAS CORP·Filed 2016·Granted Jun 13, 2017·1 cites·18 claims
- 2765US9437579B2Multiple die face-down stacking for two or more dieTESSERA INC·Filed 2015·Granted Sep 6, 2016·1 cites·15 claims
- 2863US10692842B2Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windowsINVENSAS CORP·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 2963US10503275B2Computing interface systemOPDIG INC·Filed 2014·Granted Dec 10, 2019·2 cites·30 claims
- 3059US10090280B2Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windowsINVENSAS CORP·Filed 2017·Granted Oct 2, 2018·0 cites·19 claims
- 3158US9281271B2Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrateINVENSAS CORP·Filed 2014·Granted Mar 8, 2016·0 cites·20 claims
- 3257US9515053B2Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axisINVENSAS CORP·Filed 2016·Granted Dec 6, 2016·0 cites·20 claims
- 3357US9373565B2Stub minimization for assemblies without wirebonds to package substrateINVENSAS CORP·Filed 2013·Granted Jun 21, 2016·0 cites·17 claims
- 3457US2017084584A1Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateINVENSAS CORP·Filed 2016·Application pending·0 cites
- 3557US2025079276A1Stiffener with integrated connectorsADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 3656US9224431B2Stub minimization using duplicate sets of signal terminalsINVENSAS CORP·Filed 2014·Granted Dec 29, 2015·0 cites·18 claims
- 3755US10643977B2Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windowsINVENSAS CORP·Filed 2018·Granted May 5, 2020·0 cites·20 claims
- 3854US9530458B2Stub minimization using duplicate sets of signal terminalsINVENSAS CORP·Filed 2015·Granted Dec 27, 2016·0 cites·20 claims
- 3953US2022083149A1Computing interface systemOPDIG INC·Filed 2021·Application pending·0 cites
- 4052US10032752B2Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windowsINVENSAS CORP·Filed 2016·Granted Jul 24, 2018·0 cites·20 claims
- 4151US9287195B2Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windowsINVENSAS CORP·Filed 2014·Granted Mar 15, 2016·0 cites·28 claims
- 4251US2019346940A1Computing interface systemOPDIG INC·Filed 2019·Application pending·0 cites
- 4350US9496243B2Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axisINVENSAS CORP·Filed 2016·Granted Nov 15, 2016·0 cites·20 claims
- 4448US2014267024A1Computing interface systemKELLER ERIC JEFFREY·Filed 2014·Application pending·0 cites
- 4546US9423824B2Stub minimization for multi-die wirebond assemblies with parallel windowsINVENSAS CORP·Filed 2015·Granted Aug 23, 2016·0 cites·22 claims
- 4624US6965768B1Allocation of a channel for data calls with a different useful signal/ disturb signal ratio than for channels used for voice calls in mobile radio networksMANNESMANN AG·Filed 1999·Granted Nov 15, 2005·3 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Frank Lambrecht files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →