Inventor · disambiguated record
Franz Schrank
Also filed as: ROSC LEGAL REPRESENTATIVE INGR · ROSC LEGAL REPRESENTATIVE JOER · SCHRANK FRANZ
53 granted patents·7 pending applications·156 citations·filing 1994–2022
97Inventor score
Top patents by PatentIndex Score
60 records- 0194US9684074B2Optical sensor arrangement and method of producing an optical sensor arrangementAMS AG·Filed 2014·Granted Jun 20, 2017·18 cites·14 claims
- 0293US8378496B2Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connectionAUSTRIAMICROSYSTEMS AG·Filed 2008·Granted Feb 19, 2013·27 cites·17 claims
- 0387US9735101B2Semiconductor device with through-substrate via covered by a solder ballAMS AG·Filed 2016·Granted Aug 15, 2017·4 cites·6 claims
- 0481US7898052B2Component with a semiconductor junction and method for the production thereofAUSTRIAMICROSYSTEMS AG·Filed 2005·Granted Mar 1, 2011·12 cites·13 claims
- 0580US9870988B2Method of producing a semiconductor device with through-substrate via covered by a solder ballAMS AG·Filed 2017·Granted Jan 16, 2018·2 cites·7 claims
- 0680US9206947B2LED module, LED illumination means, and LED lamp for the energy-efficient reproduction of white lightBAUMGARTNER ERWIN·Filed 2010·Granted Dec 8, 2015·10 cites·15 claims
- 0778US9553039B2Semiconductor device with through-substrate via covered by a solder ball and related method of productionAMS AG·Filed 2012·Granted Jan 24, 2017·3 cites·6 claims
- 0878US8338898B2Micro electro mechanical system (MEMS) microphone having a thin-film constructionSCHRANK FRANZ·Filed 2005·Granted Dec 25, 2012·9 cites·7 claims
- 0977US8063458B2Micromechanical component, method for fabrication and useLOEFFLER BERNHARD·Filed 2006·Granted Nov 22, 2011·14 cites·24 claims
- 1073US10283541B2Semiconductor device comprising an aperture array and method of producing such a semiconductor deviceAMS AG·Filed 2015·Granted May 7, 2019·2 cites·27 claims
- 1173US9574723B2LED module, LED illumination means, and LED lamp for the energy-efficient reproduction of white lightLUMITECH PRODUKTION UND ENTW GMBH·Filed 2015·Granted Feb 21, 2017·3 cites·10 claims
- 1273US9054261B2Photodiode device and method for production thereofTEVA JORDI·Filed 2012·Granted Jun 9, 2015·2 cites·6 claims
- 1370US8383488B2Method for producing a semiconductor component with two trenchesAUSTRIAMICROSYSTEMS AG·Filed 2007·Granted Feb 26, 2013·3 cites·10 claims
- 1470US7524337B2Method for the manufacture of electrical componentEPCOS AG·Filed 2007·Granted Apr 28, 2009·5 cites·3 claims
- 1568US9543245B2Semiconductor sensor device and method of producing a semiconductor sensor deviceAMS AG·Filed 2013·Granted Jan 10, 2017·2 cites·9 claims
- 1668US8623762B2Semiconductor device and a method for making the semiconductor deviceKRAFT JOCHEN·Filed 2009·Granted Jan 7, 2014·4 cites·6 claims
- 1768US2022221363A1Pressure Sensor Device and Method for Forming a Pressure Sensor DeviceSCIOSENSE BV·Filed 2022·Application pending·0 cites
- 1867US8199963B2Microphone arrangement and method for production thereofSCHRANK FRANZ·Filed 2007·Granted Jun 12, 2012·4 cites·14 claims
- 1966US11107848B2Semiconductor device for detection of radiation and method of producing a semiconductor device for detection of radiationAMS AG·Filed 2014·Granted Aug 31, 2021·2 cites·2 claims
- 2063US10256147B2Dicing methodAMS AG·Filed 2015·Granted Apr 9, 2019·1 cites·5 claims
- 2162US11313749B2Pressure sensor device and method for forming a pressure sensor deviceSCIOSENSE BV·Filed 2017·Granted Apr 26, 2022·0 cites·9 claims
- 2262US7215236B2Electric component, method for the production thereof and use of the sameEPCOS AG·Filed 2001·Granted May 8, 2007·8 cites·10 claims
- 2359US7923792B2MEMS sensor comprising a deformation-free back electrodeAUSTRIAMICROSYSTEMS AG·Filed 2007·Granted Apr 12, 2011·2 cites·10 claims
- 2456US11460181B2LED module and use of the LED moduleTDK ELECTRONICS AG·Filed 2019·Granted Oct 4, 2022·0 cites·14 claims
- 2556US9773729B2Method of producing a semiconductor device with through-substrate via covered by a solder ballAMS AG·Filed 2016·Granted Sep 26, 2017·0 cites·5 claims
- 2654US9818724B2Interposer-chip-arrangement for dense packaging of chipsAMS AG·Filed 2014·Granted Nov 14, 2017·0 cites·3 claims
- 2753US6906611B2Ceramic component comprising an environmentally stable contact systemEPCOS AG·Filed 2001·Granted Jun 14, 2005·2 cites·14 claims
- 2852US10340254B2Method of producing an interposer-chip-arrangement for dense packaging of chipsAMS AG·Filed 2017·Granted Jul 2, 2019·0 cites·6 claims
- 2952US10332931B2Semiconductor device for wafer-scale integrationAMS AG·Filed 2017·Granted Jun 25, 2019·0 cites·5 claims
- 3052US9608035B2Method of wafer-scale integration of semiconductor devices and semiconductor deviceAMS AG·Filed 2013·Granted Mar 28, 2017·0 cites·5 claims
- 3152US2024321932A1Thin photodetector device and fabrication thereofAMS OSRAM AG·Filed 2022·Application pending·0 cites
- 3250US7145430B2Electrical component and method for making the componentEPCOS AG·Filed 2001·Granted Dec 5, 2006·4 cites·19 claims
- 3349US9570390B2Semiconductor device with integrated hot plate and recessed substrate and method of productionAMS AG·Filed 2013·Granted Feb 14, 2017·0 cites·14 claims
- 3446US8969193B2Method of producing a semiconductor device having an interconnect through the substrateAMS AG·Filed 2013·Granted Mar 3, 2015·0 cites·11 claims
- 3546US8110886B2Photodiode with integrated semiconductor circuit and method for the production thereofMEINHARDT GERALD·Filed 2006·Granted Feb 7, 2012·1 cites·7 claims
- 3646US5519374AHybrid thermistor temperature sensorSIEMENS MATSUSHITA COMPONENTS·Filed 1994·Granted May 21, 1996·7 cites·11 claims
- 3745US11139207B2Method for manufacturing a semiconductor device and semiconductor deviceAMS AG·Filed 2018·Granted Oct 5, 2021·0 cites·18 claims
- 3845US10847664B2Optical package and method of producing an optical packageAMS AG·Filed 2016·Granted Nov 24, 2020·0 cites·18 claims
- 3945US7430797B2Method for making an electrical componentEPCOS AG·Filed 2006·Granted Oct 7, 2008·0 cites·4 claims
- 4044US11764109B2Method of forming a through-substrate via and a semiconductor device comprising a through-substrate viaAMS AG·Filed 2019·Granted Sep 19, 2023·0 cites·11 claims
- 4144US10644047B2Optoelectronic device with a refractive element and a method of producing such an optoelectronic deviceAMS AG·Filed 2016·Granted May 5, 2020·0 cites·17 claims
- 4243US8530914B2Optoelectronic components with adhesion agentSCHRANK FRANZ·Filed 2006·Granted Sep 10, 2013·0 cites·15 claims
- 4343US2015340264A1Method of application of a carrier to a device waferAMS AG·Filed 2014·Application pending·0 cites
- 4442US11271134B2Method for manufacturing an optical sensor and optical sensorAMS AG·Filed 2018·Granted Mar 8, 2022·0 cites·10 claims
- 4542US2009212378A1Method for producing a micromechanical structural element and semiconductor arrangementAUSTRIAMICROSYSTEMS AG·Filed 2006·Application pending·0 cites
- 4641US11367672B2Semiconductor device with through-substrate viaAMS AG·Filed 2019·Granted Jun 21, 2022·0 cites·12 claims
- 4741US8658534B2Method for producing a semiconductor component, and semiconductor componentSCHRANK FRANZ·Filed 2009·Granted Feb 25, 2014·0 cites·11 claims
- 4841US2002166607A1Process and device for low-pressure carbonitriding of steel partsFiled 2002·Application pending·0 cites
- 4940US10943936B2Method of producing an optical sensor at wafer-level and optical sensorAMS AG·Filed 2017·Granted Mar 9, 2021·0 cites·11 claims
- 5040US10468541B2Semiconductor device with through-substrate via and corresponding method of manufactureAMS AG·Filed 2014·Granted Nov 5, 2019·0 cites·15 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →