Inventor · disambiguated record
Frank Yu
Also filed as: YU FRANK · YU FRANK S
8 granted patents·4 pending applications·26 citations·filing 2006–2019
80Inventor score
Top patents by PatentIndex Score
12 records- 0188US8304871B2Exposed die package for direct surface mountingYU FRANK·Filed 2011·Granted Nov 6, 2012·13 cites·16 claims
- 0283US8470644B2Exposed die package for direct surface mountingTEXAS INSTRUMENTS INC·Filed 2012·Granted Jun 25, 2013·7 cites·4 claims
- 0365US8058706B2Delamination resistant packaged die having support and shaped die having protruding lip on supportFENG CHIEN-TE·Filed 2009·Granted Nov 15, 2011·5 cites·17 claims
- 0462US10263648B2Low cost millimeter wave receiver and method for operating sameBOEING CO·Filed 2017·Granted Apr 16, 2019·1 cites·29 claims
- 0553US9272302B2Mixing apparatus for mixing bonding adhesive at die bonder before dispenseTEXAS INSTRUMENTS INC·Filed 2013·Granted Mar 1, 2016·0 cites·5 claims
- 0652US8668794B2Mixing bonding adhesive at die bonder before dispenseYU FRANK·Filed 2011·Granted Mar 11, 2014·0 cites·9 claims
- 0748US8039955B2Mold lock on heat spreaderTEXAS INSTRUMENTS INC·Filed 2009·Granted Oct 18, 2011·0 cites·20 claims
- 0847US11081428B2Electronic device with three dimensional thermal padTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 3, 2021·0 cites·22 claims
- 0940US2009236715A1Semiconductor package structure with laminated interposing layerANO KAZUAKI·Filed 2008·Application pending·0 cites
- 1037US2012202300A1Die bonder including automatic bond line thickness measurementYU FRANK·Filed 2011·Application pending·0 cites
- 1134US2008073028A1Methods and apparatus to dispense adhesive for semiconductor packagingYU FRANK·Filed 2006·Application pending·0 cites
- 1233US2012040477A1Ai epoxy adjustmentYU FRANK·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Frank Yu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →