Inventor · disambiguated record
Fu-Ting Chang
Also filed as: CHANG FU-TING
1 granted patent·5 pending applications·0 citations·filing 2018–2025
13Inventor score
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6 records- 0178US2025349522A1Impedance control of local areas of a substrate during plasma deposition thereon in a large pecvd chamberAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0269US12394606B2Impedance control of local areas of a substrate during plasma deposition thereon in a large PECVD chamberAPPLIED MATERIALS INC·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 0351US2025157794A1Systems and methods for reducing irregularities within a plasma-based processing chamberAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0449US2019382891A1Method and solution for resolving cgt mura issueAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 0540US2021327731A1Mass transfer method, mass transfer device and buffer carrierADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 0628US2018218905A1Applying equalized plasma coupling design for mura free susceptorAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →