Inventor · disambiguated record
Fu-Jier Fan
Also filed as: FAN FU · FAN FU-JIER
49 granted patents·6 pending applications·760 citations·filing 2000–2025
98Inventor score
Top patents by PatentIndex Score
55 records- 0199US11063038B2Through silicon via design for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 13, 2021·7 cites·20 claims
- 0298US11410995B1Semiconductor structure and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 9, 2022·6 cites·20 claims
- 0398US10050033B1High voltage integration for HKMG technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 14, 2018·18 cites·20 claims
- 0496US6482669B1Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 19, 2002·81 cites·13 claims
- 0596US6426281B1Method to form bump in bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 30, 2002·147 cites·17 claims
- 0695US10340357B2Dishing prevention dummy structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 2, 2019·9 cites·20 claims
- 0794US10629592B2Through silicon via design for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·7 cites·20 claims
- 0893US12500193B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 16, 2025·1 cites·20 claims
- 0993US6605524B1Bumping process to increase bump height and to create a more robust bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 12, 2003·78 cites·24 claims
- 1093US6586323B1Method for dual-layer polyimide processing on bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 1, 2003·76 cites·13 claims
- 1192US11705449B2Through silicon via design for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 18, 2023·1 cites·20 claims
- 1292US10964692B2Through silicon via design for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·5 cites·20 claims
- 1391US7183598B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Feb 27, 2007·10 cites·17 claims
- 1491US6632700B1Method to form a color image sensor cell while protecting the bonding pad structure from damageTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 14, 2003·58 cites·20 claims
- 1590US10516029B2Dishing prevention dummy structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 24, 2019·4 cites·20 claims
- 1686US6958546B2Method for dual-layer polyimide processing on bumping technologyTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 25, 2005·45 cites·9 claims
- 1785US7816169B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Oct 19, 2010·5 cites·20 claims
- 1885US6956292B2Bumping process to increase bump height and to create a more robust bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 18, 2005·37 cites·20 claims
- 1984US11302691B2High voltage integration for HKMG technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·1 cites·20 claims
- 2083US7323784B2Top via pattern for bond pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jan 29, 2008·14 cites·12 claims
- 2183US6583039B2Method of forming a bump on a copper padTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 24, 2003·37 cites·18 claims
- 2282US6649507B1Dual layer photoresist method for fabricating a mushroom bumping plating structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Nov 18, 2003·33 cites·25 claims
- 2379US10790279B2High voltage integration for HKMG technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·1 cites·20 claims
- 2478US6936923B2Method to form very a fine pitch solder bump using methods of electroplatingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 30, 2005·23 cites·9 claims
- 2578US2024371865A1Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2677US10950708B2Dishing prevention dummy structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·1 cites·20 claims
- 2777US10510750B2High voltage integration for HKMG technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 2876US12100706B2Semiconductor structure and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 24, 2024·0 cites·20 claims
- 2976US9853149B1Floating grid and crown-shaping poly for improving ILD CMP dishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·2 cites·20 claims
- 3076US7485906B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Feb 3, 2009·2 cites·20 claims
- 3175US11646308B2Through silicon via design for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 9, 2023·0 cites·20 claims
- 3275US6372545B1Method for under bump metal patterning of bumping processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 16, 2002·22 cites·35 claims
- 3375US2025318258A1Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3474US11569363B2Dishing prevention dummy structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 3574US10937785B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 2, 2021·2 cites·8 claims
- 3673US11004844B2Recessed STI as the gate dielectric of HV deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 11, 2021·1 cites·20 claims
- 3773US6876049B2Colors only process to reduce package yield lossTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 5, 2005·12 cites·20 claims
- 3872US8049295B2Coupling well structure for improving HVMOS performanceTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 1, 2011·2 cites·11 claims
- 3969US12414361B2Method of manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 4069US11710712B2Semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 4169US2025210614A1Semiconductor structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4267US10916542B2Recessed STI as the gate dielectric of HV deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 9, 2021·1 cites·20 claims
- 4363US2021280577A1Recessed STI as the Gate Dielectric of HV DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 4462US12272686B2Semiconductor structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 8, 2025·0 cites·20 claims
- 4562US6426283B1Method for bumping and backlapping a semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 30, 2002·10 cites·18 claims
- 4658US10937891B2Spacer structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 2, 2021·0 cites·20 claims
- 4758US2025054906A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4855US9111957B2Coupling well structure for improving HVMOS performanceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 18, 2015·0 cites·22 claims
- 4954US7816214B2Coupling well structure for improving HVMOS performanceTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Oct 19, 2010·0 cites·13 claims
- 5053US11417649B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 16, 2022·0 cites·20 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Fu-Jier Fan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →