Inventor · disambiguated record
Fu-Yen Ho
Also filed as: HO FU-YEN
1 granted patent·2 pending applications·3 citations·filing 2013–2015
20Inventor score
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3 records- 0172US9508676B1Semiconductor package structure having hollow chamber and bottom substrate and package process thereofCHIPBOND TECH CORP·Filed 2015·Granted Nov 29, 2016·3 cites·17 claims
- 0234US2014145976A1Color filter substrate, in-cell optical touch display panel including the same and materials of infrared filter layerCHUNGHWA PICTURE TUBES LTD·Filed 2013·Application pending·0 cites
- 0328US2016318756A1Process for manufacturing semiconductor package having hollow chamberCHIPBOND TECH CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →