Inventor · disambiguated record
Futoshi Hosoya
Also filed as: HOSOYA FUTOSHI
9 granted patents·1 pending application·143 citations·filing 1996–2018
88Inventor score
Top patents by PatentIndex Score
10 records- 0183US6072122AMulti-chip packaging structure having chips sealably mounted on opposing surfaces of substratesNEC CORP·Filed 1998·Granted Jun 6, 2000·70 cites·4 claims
- 0275US5795799AMethod for manufacturing electronic apparatus sealed by concave molded resin enveloperNEC CORP·Filed 1996·Granted Aug 18, 1998·44 cites·19 claims
- 0364US6879033B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2003·Granted Apr 12, 2005·8 cites·7 claims
- 0463US10075111B2Semiconductor device and electrically-powered equipmentRENESAS ELECTRONICS CORP·Filed 2015·Granted Sep 11, 2018·1 cites·20 claims
- 0562US6882040B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Apr 19, 2005·7 cites·20 claims
- 0657US6853066B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Feb 8, 2005·5 cites·20 claims
- 0754US7242085B2Semiconductor device including a semiconductor chip mounted on a metal baseNEC ELECTRONICS CORP·Filed 2004·Granted Jul 10, 2007·4 cites·28 claims
- 0851US2007210440A1Semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 0950US7145230B2Semiconductor device with a solder creep-up prevention zoneNEC ELECTRONICS CORP·Filed 2004·Granted Dec 5, 2006·4 cites·16 claims
- 1049US10243492B2Semiconductor device and electrically-powered equipmentRENESAS ELECTRONICS CORP·Filed 2018·Granted Mar 26, 2019·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →