Inventor · disambiguated record
Fumito Itou
Also filed as: ITOU FUMITO
9 granted patents·3 pending applications·194 citations·filing 2003–2015
89Inventor score
Technology areasH10W
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD5PANASONIC CORP4CHIDA CHIKAKO1ITOU FUMITO1PANASONIC IP MAN CO LTD1
Top patents by PatentIndex Score
12 records- 0192US7521288B2Stacked chip semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2007·Granted Apr 21, 2009·29 cites·6 claims
- 0292US7498668B2Stacked semiconductor device and lower module of stacked semiconductor devicePANASONIC CORP·Filed 2006·Granted Mar 3, 2009·28 cites·18 claims
- 0390US7138706B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Nov 21, 2006·69 cites·20 claims
- 0480US6992396B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 31, 2006·28 cites·6 claims
- 0576US9545026B2Electronic component module and an assembly including the samePANASONIC CORP·Filed 2015·Granted Jan 10, 2017·3 cites·20 claims
- 0674US7298045B2Stacked semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 20, 2007·23 cites·9 claims
- 0768US7239021B2Stacked chip semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 3, 2007·14 cites·2 claims
- 0844US2006091563A1Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 0941US9474179B2Electronic component packagePANASONIC CORP·Filed 2015·Granted Oct 18, 2016·0 cites·15 claims
- 1039US2012256322A1Semiconductor deviceITOU FUMITO·Filed 2012·Application pending·0 cites
- 1131US2016322342A1Semiconductor devicePANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
- 1227US8421233B2Semiconductor deviceCHIDA CHIKAKO·Filed 2010·Granted Apr 16, 2013·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →