Semiconductor device and method for fabricating the same

Abstract

A semiconductor device has a substrate having electrode pads, a first semiconductor chip mounted on the substrate with a first adhesion layer interposed therebetween, a second semiconductor chip mounted on the first semiconductor chip with a second adhesion layer interposed therebetween and having electrode pads on the upper surface thereof, wires for bonding the electrode pads of the substrate and the electrode pads of the second semiconductor chip to each other, and a mold resin sealing therein the first and second semiconductor chips and the wires. The peripheral edge portion of the first adhesion layer is protruding outwardly from the first semiconductor chip and the peripheral edge portion of the second semiconductor chip is protruding outwardly beyond the peripheral edge portion of the first semiconductor chip.

1 - 6 . (canceled)  
   
   
       7 . A method for fabricating a semiconductor device, the method comprising: 
 a first step of disposing a first semiconductor chip on a substrate having an electrode pad;    a second step of injecting an adhesive in a space between the substrate and the first semiconductor chip to form a first adhesion layer composed of the adhesive and having a peripheral edge portion protruding outwardly from the first semiconductor chip;    a third step of mounting, on the first semiconductor chip, a second semiconductor chip having an electrode pad on a peripheral edge portion of an upper surface thereof with a second adhesion layer interposed therebetween;    a fourth step of bonding the electrode pad of the substrate and the electrode pad of the second semiconductor chip to each other with a wire; and    a fifth step of sealing the first and second semiconductor chips and the wire with a mold resin,    the third step including the step of protruding a peripheral edge portion of the second semiconductor chip outwardly beyond a peripheral edge portion of the first semiconductor chip.    
   
   
       8 . The method of  claim 7 , wherein the third step includes the step of protruding the peripheral edge portion of the second semiconductor chip outwardly beyond the peripheral edge portion of the first adhesion layer.  
   
   
       9 . The method of  claim 7 , wherein the first step includes the step of disposing the first semiconductor chip such that a center of the first semiconductor chip is offset from a center of the substrate in a direction of an edge of the first semiconductor chip opposite to a direction of an edge thereof from which the adhesive is injected in the second step.  
   
   
       10 . The method of  claim 7 , wherein the third step includes the step of mounting the second semiconductor chip such that a center of the second semiconductor chip is offset from a center of the first semiconductor chip.  
   
   
       11 . The method of  claim 10 , wherein the third step includes the step of mounting the second semiconductor chip such that the center of the second semiconductor chip is offset from the center of the first semiconductor chip in a direction of an edge of the first semiconductor chip from which the adhesive is injected in the second step.  
   
   
       12 . The method of  claim 7 , wherein the third step includes the step of mounting the second semiconductor chip such that a center of the second semiconductor chip substantially coincides with a center of the substrate.