Inventor · disambiguated record
Takashi Yui
Also filed as: YUI TAKASHI
25 granted patents·8 pending applications·252 citations·filing 2001–2025
95Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD13PANASONIC CORP8NUVOTON TECHNOLOGY CORP JAPAN3PANASONIC IP MAN CO LTD2YUI TAKASHI2
Top patents by PatentIndex Score
33 records- 0192US7521288B2Stacked chip semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2007·Granted Apr 21, 2009·29 cites·6 claims
- 0290US7138706B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Nov 21, 2006·69 cites·20 claims
- 0389US6509638B2Semiconductor device having a plurality of stacked semiconductor chips on a wiring boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 21, 2003·41 cites·4 claims
- 0484US7298043B2Semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Nov 20, 2007·14 cites·4 claims
- 0580US6992396B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 31, 2006·28 cites·6 claims
- 0675US7964475B2Semiconductor wafer, method of manufacturing the same and semiconductor devicePANASONIC CORP·Filed 2007·Granted Jun 21, 2011·6 cites·20 claims
- 0773US7087455B2Semiconductor device and manufacturing method for the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 8, 2006·17 cites·6 claims
- 0871US8330266B2Semiconductor deviceYUI TAKASHI·Filed 2010·Granted Dec 11, 2012·4 cites·11 claims
- 0968US7239021B2Stacked chip semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 3, 2007·14 cites·2 claims
- 1068US7082923B2Idling speed control system and methodDENSO CORP·Filed 2005·Granted Aug 1, 2006·4 cites·8 claims
- 1168US2025293109A1Semiconductor device and mounting substrateNUVOTON TECHNOLOGY CORP JAPAN·Filed 2025·Application pending·0 cites
- 1266US8866284B2Semiconductor device comprising an extended semiconductor chip having an extensionPANASONIC CORP·Filed 2013·Granted Oct 21, 2014·2 cites·21 claims
- 1364US6707143B2Stacked semiconductor chips attached to a wiring boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 16, 2004·8 cites·10 claims
- 1462US12278601B2Power amplifier semiconductor deviceNUVOTON TECHNOLOGY CORP JAPAN·Filed 2024·Granted Apr 15, 2025·0 cites·20 claims
- 1562US7078818B2Semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 18, 2006·7 cites·9 claims
- 1662US6777796B2Stacked semiconductor chips on a wiring boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 17, 2004·7 cites·10 claims
- 1761US9917066B2Semiconductor device having stacked chips, a re-distribution layer, and penetration electrodesPANASONIC CORP·Filed 2014·Granted Mar 13, 2018·1 cites·22 claims
- 1861US2025070063A1Semiconductor deviceNUVOTON TECHNOLOGY CORP JAPAN·Filed 2024·Application pending·0 cites
- 1960US8766418B2Semiconductor devicePANASONIC CORP·Filed 2014·Granted Jul 1, 2014·1 cites·8 claims
- 2055US8022305B2Semiconductor device with a wiring board having an angled linear partPANASONIC CORP·Filed 2009·Granted Sep 20, 2011·0 cites·4 claims
- 2147US2006208349A1Semiconductor device and manufacturing method for the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 2246US2006079023A1Semiconductor device and manufacturing method for the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 2345US9443793B2Semiconductor devicePANASONIC CORP·Filed 2013·Granted Sep 13, 2016·0 cites·20 claims
- 2444US2006091563A1Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 2544US2010044880A1Semiconductor device and semiconductor moduleAOKURA ISAMU·Filed 2009·Application pending·0 cites
- 2643US10006381B2Diagnostic system and diagnostic method for internal combustion engineTOYOTA MOTOR CO LTD·Filed 2014·Granted Jun 26, 2018·0 cites·16 claims
- 2741US10305008B2Semiconductor module and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2017·Granted May 28, 2019·0 cites·21 claims
- 2841US6693347B2Semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 17, 2004·0 cites·2 claims
- 2939US10847702B2Semiconductor modulePANASONIC IP MAN CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·21 claims
- 3037US8833150B2Apparatus and method for detecting abnormality of imbalance of air-fuel ratios among cylindersYUI TAKASHI·Filed 2012·Granted Sep 16, 2014·0 cites·4 claims
- 3137US8716868B2Semiconductor module for stacking and stacked semiconductor moduleKAWABATA TAKESHI·Filed 2010·Granted May 6, 2014·0 cites·5 claims
- 3234US2015371971A1Semiconductor devicePANASONIC CORP·Filed 2015·Application pending·0 cites
- 3327US2010283129A1Semiconductor device and method for fabricating the sameTETANI MICHINARI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →