Inventor · disambiguated record
Yoshiyuki Arai
Also filed as: ARAI YOSHIYUKI
29 granted patents·14 pending applications·469 citations·filing 2000–2025
96Inventor score
Files withTORAY ENG CO LTD12MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7UNIV OSAKA5PANASONIC CORP4ABBOTT LAB2
Top patents by PatentIndex Score
43 records- 0197US6582991B1Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 24, 2003·175 cites·5 claims
- 0294US10755958B2Transfer method, mounting method, transfer device, and mounting deviceTORAY ENG CO LTD·Filed 2019·Granted Aug 25, 2020·11 cites·7 claims
- 0392US7521288B2Stacked chip semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2007·Granted Apr 21, 2009·29 cites·6 claims
- 0490US7138706B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Nov 21, 2006·69 cites·20 claims
- 0586US6433285B2Printed wiring board, IC card module using the same, and method for producing IC card moduleMATSUSHITA ELECTRONICS CORP·Filed 2000·Granted Aug 13, 2002·46 cites·15 claims
- 0684US7154189B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Dec 26, 2006·10 cites·6 claims
- 0780US6992396B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 31, 2006·28 cites·6 claims
- 0876US6892447B1Chip mounting deviceTORAY ENG CO LTD·Filed 2000·Granted May 17, 2005·17 cites·31 claims
- 0975US6821381B1Tool for thermo-compression-bonding chips, and chip packaging device having the sameTORAY ENG CO LTD·Filed 2000·Granted Nov 23, 2004·22 cites·21 claims
- 1072US7918481B2Vehicle airbag device and method for manufacturing the sameHONDA MOTOR CO LTD·Filed 2009·Granted Apr 5, 2011·10 cites·15 claims
- 1168US7239021B2Stacked chip semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 3, 2007·14 cites·2 claims
- 1268US6905912B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 14, 2005·12 cites·2 claims
- 1364US8960774B2Impact absorbing body for a vehicle door trimSAKHARE NILESH ISHWARDAS·Filed 2013·Granted Feb 24, 2015·7 cites·20 claims
- 1463US2025001410A1Systems and Methods for Sample AnalysisABBOTT LAB·Filed 2022·Application pending·0 cites
- 1562US7876570B2Module with embedded electronic componentsPANASONIC CORP·Filed 2009·Granted Jan 25, 2011·0 cites·4 claims
- 1661US12176520B2Positive electrode active material, method for producing positive electrode active material, positive electrode, and secondary batterySANOH IND CO LTD·Filed 2018·Granted Dec 24, 2024·0 cites·9 claims
- 1761US6825915B2Alignment deviceTORAY ENGENEERING CO LTD·Filed 2001·Granted Nov 30, 2004·11 cites·24 claims
- 1856US2023176047A1Systems and methods for sample analysisABBOTT LAB·Filed 2021·Application pending·0 cites
- 1956US2025015039A1Bonding device and bonding methodTORAY ENG CO LTD·Filed 2024·Application pending·0 cites
- 2056US2025014936A1Transfer device and transfer methodTORAY ENG CO LTD·Filed 2024·Application pending·0 cites
- 2156US2023360936A1Transfer device and transfer substrateTORAY ENG CO LTD·Filed 2023·Application pending·0 cites
- 2255US2025308955A1Transfer deviceTORAY ENG CO LTD·Filed 2025·Application pending·0 cites
- 2354US11372007B2Method of detecting biological material, and chemiluminescent indicator used thereinUNIV OSAKA·Filed 2018·Granted Jun 28, 2022·0 cites·20 claims
- 2454US6811627B2Chip mounting device and callibration method thereinTORAY ENG CO LTD·Filed 2001·Granted Nov 2, 2004·4 cites·15 claims
- 2554US6653410B1Method for treating resin compositionASAHI CHEMICAL IND·Filed 2000·Granted Nov 25, 2003·2 cites·7 claims
- 2653US10181460B2Method for manufacturing semiconductor device, semiconductor mounting device, and memory device manufactured by method for manufacturing semiconductor deviceTORAY ENG CO LTD·Filed 2016·Granted Jan 15, 2019·1 cites·18 claims
- 2752US11268906B2Microscope and method for observing biological specimen in living stateJAPAN SCIENCE & TECH AGENCY·Filed 2018·Granted Mar 8, 2022·0 cites·13 claims
- 2852US7606047B2Module with embedded electronic componentsPANASONIC CORP·Filed 2006·Granted Oct 20, 2009·0 cites·11 claims
- 2950US9632303B2Optical microscope, and autofocus device for optical microscopeUNIV OSAKA·Filed 2013·Granted Apr 25, 2017·0 cites·9 claims
- 3047US7341877B2Calibration method in a chip mounting deviceTORAY ENG CO LTD·Filed 2004·Granted Mar 11, 2008·1 cites·2 claims
- 3145US11619628B2Device and determination system using sameUNIV OSAKA·Filed 2018·Granted Apr 4, 2023·0 cites·14 claims
- 3245US11138957B2Endpin main body fixing member and fixing tool, and musical instrument equipped with fixing toolARAI YOSHITOMO·Filed 2019·Granted Oct 5, 2021·0 cites·10 claims
- 3345US9945784B2Fluorescent proteinUNIV OSAKA·Filed 2014·Granted Apr 17, 2018·0 cites·6 claims
- 3444US8023277B2Electronic component integrated modulePANASONIC CORP·Filed 2007·Granted Sep 20, 2011·0 cites·11 claims
- 3544US2006091563A1Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 3641US2004238848A1Composite titanium oxide film and method for formation thereof and titanium electrolytic capacitorFiled 2002·Application pending·0 cites
- 3740US2018194816A1Fluorescent proteinUNIV OSAKA·Filed 2016·Application pending·0 cites
- 3840US2003010407A1Method for forming titanium oxide film and titanium electrolytic capacitorFiled 2001·Application pending·0 cites
- 3939US11495571B2Mounting method and mounting deviceTORAY ENG CO LTD·Filed 2017·Granted Nov 8, 2022·0 cites·3 claims
- 4036US2020298270A1Continuous coating device and continuous coating methodTORAY ENG CO LTD·Filed 2017·Application pending·0 cites
- 4136US2010197187A1Method and apparatus for manufacturing a liquid crystal componentNARABA SATORU·Filed 2008·Application pending·0 cites
- 4235US2003168145A1Method and apparatus for mountingFiled 2001·Application pending·0 cites
- 4333US2003106210A1Chip-mounting device and method of alignmentFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →