Inventor · disambiguated record
Fumio Ootsuka
Also filed as: OOTSUKA FUMIO
40 granted patents·2 pending applications·1,275 citations·filing 1979–2016
98Inventor score
Top patents by PatentIndex Score
42 records- 0199US10090316B23D stacked multilayer semiconductor memory using doped select transistor channelASM IP HOLDING BV·Filed 2016·Granted Oct 2, 2018·468 cites·13 claims
- 0295US6982465B2Semiconductor device with CMOS-field-effect transistors having improved drain current characteristicsRENESAS TECH CORP·Filed 2001·Granted Jan 3, 2006·121 cites·16 claims
- 0392US6613634B2Method of manufacturing a semiconductor device using oblique ion injectionHITACHI LTD·Filed 2001·Granted Sep 2, 2003·68 cites·21 claims
- 0490US4291749AMethod and apparatus for controlling compartment temperature of a vehicleNIPPON DENSO CO·Filed 1979·Granted Sep 29, 1981·60 cites·3 claims
- 0588US4937645ASemiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 1988·Granted Jun 26, 1990·58 cites·16 claims
- 0683US5202275ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1990·Granted Apr 13, 1993·43 cites·23 claims
- 0782US6524903B2Method of manufacturing a semiconductor device having two peaks in an impurity concentration distributionHITACHI LTD·Filed 2001·Granted Feb 25, 2003·33 cites·20 claims
- 0880US7042051B2Semiconductor device including impurity layer having a plurality of impurity peaks formed beneath the channel regionRENESAS TECH CORP·Filed 2002·Granted May 9, 2006·29 cites·28 claims
- 0979US5780882ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1995·Granted Jul 14, 1998·33 cites·8 claims
- 1076US6635937B2Semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Oct 21, 2003·14 cites·23 claims
- 1176US6548847B2Semiconductor integrated circuit device having a first wiring strip exposed through a connecting hole, a transition-metal film in the connecting hole and an aluminum wiring strip thereover, and a transition-metal nitride film between the aluminum wiring strip and the transition-metal filmHITACHI LTD·Filed 2001·Granted Apr 15, 2003·12 cites·33 claims
- 1274US7041549B2Method for manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted May 9, 2006·17 cites·16 claims
- 1373US5331191ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1992·Granted Jul 19, 1994·24 cites·11 claims
- 1471US5512502AManufacturing method for semiconductor integrated circuit deviceHITACHI LTD·Filed 1995·Granted Apr 30, 1996·34 cites·24 claims
- 1569US5798551ASemiconductor integrated circuit device and method of manufacturing the sameHITACHI LTD·Filed 1997·Granted Aug 25, 1998·23 cites·28 claims
- 1668US5329138AShort channel CMOS device capable of high performance at low voltageHITACHI LTD·Filed 1992·Granted Jul 12, 1994·34 cites·8 claims
- 1767US6847093B2Semiconductor integrated circuit deviceRENESAS TEHNOLOGY CORP·Filed 2003·Granted Jan 25, 2005·17 cites·14 claims
- 1866US6806128B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted Oct 19, 2004·12 cites·35 claims
- 1966US4456055AAutomotive air conditioner having coating power control deviceNIPPON DENSO CO·Filed 1982·Granted Jun 26, 1984·25 cites·9 claims
- 2065US7427537B2Semiconductor integrated circuit device and method for manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Sep 23, 2008·2 cites·9 claims
- 2163US6838320B2Method for manufacturing a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2001·Granted Jan 4, 2005·8 cites·13 claims
- 2262US6894334B2Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI VLSI ENG·Filed 2003·Granted May 17, 2005·5 cites·33 claims
- 2362US5309392ASemiconductor IC device using ferroelectric material in data storage cells with light assisted state transitionHITACHI LTD·Filed 1993·Granted May 3, 1994·22 cites·8 claims
- 2461US6169324B1Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1999·Granted Jan 2, 2001·13 cites·19 claims
- 2561US5739589ASemiconductor integrated circuit device process for fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1996·Granted Apr 14, 1998·13 cites·21 claims
- 2653US6762444B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Jul 13, 2004·4 cites·10 claims
- 2752US6924237B2Method for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Aug 2, 2005·4 cites·20 claims
- 2852US6661063B2Semiconductor integrated circuit deviceHITACHI LTD·Filed 2001·Granted Dec 9, 2003·6 cites·19 claims
- 2951US6342412B1Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1999·Granted Jan 29, 2002·8 cites·19 claims
- 3051US4463801AAir induction control system for vehicle air conditionersNIPPON DENSO CO·Filed 1982·Granted Aug 7, 1984·12 cites·10 claims
- 3150US6747324B2Method of manufacturing a semiconductor integrated circuit deviceHITACHI LTD·Filed 2003·Granted Jun 8, 2004·5 cites·9 claims
- 3250US6127255ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1997·Granted Oct 3, 2000·8 cites·12 claims
- 3350US5811316AMethod of forming teos oxide and silicon nitride passivation layer on aluminum wiringHITACHI LTD·Filed 1995·Granted Sep 22, 1998·8 cites·13 claims
- 3450US4486837AApparatus for controlling operation of automobile air conditionerNIPPON DENSO CO·Filed 1982·Granted Dec 4, 1984·11 cites·3 claims
- 3547US5557147ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1994·Granted Sep 17, 1996·7 cites·18 claims
- 3646US7022563B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Apr 4, 2006·2 cites·22 claims
- 3744US7118949B2Semiconductor integrated circuit device and method for manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Oct 10, 2006·1 cites·13 claims
- 3844US7075157B2Method of manufacturing a semiconductor integrated circuit deviceHITACHI LTD·Filed 2004·Granted Jul 11, 2006·3 cites·3 claims
- 3944US6171892B1Method of manufacturing a semiconductor integrated circuit deviceHITACHI LTD·Filed 1998·Granted Jan 9, 2001·6 cites·32 claims
- 4044US2005186724A1Method for manufacturing semiconductor integrated circuit deviceFiled 2005·Application pending·0 cites
- 4140US6603178B2Semiconductor integrated circuit device and method of manufacture thereofHITACHI LTD·Filed 2001·Granted Aug 5, 2003·2 cites·14 claims
- 4237US2005205940A1Semiconductor device and method for manufacturing the sameSEMICONDUCTOR LEADING EDGE TEC·Filed 2004·Application pending·0 cites
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