Inventor · disambiguated record
Fumihiko Taniguchi
Also filed as: TANIGUCHI FUMIHIKO
16 granted patents·3 pending applications·1,116 citations·filing 1998–2015
96Inventor score
Top patents by PatentIndex Score
19 records- 0199US6489676B2Semiconductor device having an interconnecting post formed on an interposer within a sealing resinFUJITSU LTD·Filed 2001·Granted Dec 3, 2002·289 cites·12 claims
- 0297US6388333B1Semiconductor device having protruding electrodes higher than a sealed portionFUJITSU LTD·Filed 2000·Granted May 14, 2002·285 cites·11 claims
- 0395US6344407B1Method of manufacturing solder bumps and solder joints using formic acidFUJITSU LTD·Filed 2000·Granted Feb 5, 2002·75 cites·25 claims
- 0491US6472746B2Semiconductor device having bonding wires serving as external connection terminalsFUJITSU LTD·Filed 2001·Granted Oct 29, 2002·69 cites·16 claims
- 0590US6404062B1Semiconductor device and structure and method for mounting the sameFUJITSU LTD·Filed 2000·Granted Jun 11, 2002·90 cites·10 claims
- 0689US6812066B2Semiconductor device having an interconnecting post formed on an interposer within a sealing resinFUJITSU LTD·Filed 2002·Granted Nov 2, 2004·48 cites·6 claims
- 0787US6972487B2Multi chip package structure having a plurality of semiconductor chips mounted in the same packageFUJITSU LTD·Filed 2002·Granted Dec 6, 2005·36 cites·14 claims
- 0882US6629462B2Acceleration sensor, an acceleration detection apparatus, and a positioning deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 7, 2003·27 cites·39 claims
- 0979US7192798B2Fingerprint sensor apparatus and manufacturing method thereofFUJITSU LTD·Filed 2002·Granted Mar 20, 2007·28 cites·10 claims
- 1077US7193862B2Ceramic laminated device, communication equipment and method of manufacturing ceramic laminated deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 20, 2007·14 cites·14 claims
- 1177US6166433AResin molded semiconductor device and method of manufacturing semiconductor packageFUJITSU LTD·Filed 1998·Granted Dec 26, 2000·59 cites·16 claims
- 1276US6291895B1Method of fabricating semiconductor having through holeFUJITSU LTD·Filed 1999·Granted Sep 18, 2001·40 cites·5 claims
- 1368US6670221B2Semiconductor device having a built-in contact-type sensor and manufacturing method thereofFUJITSU LTD·Filed 2002·Granted Dec 30, 2003·14 cites·10 claims
- 1457US6160313ASemiconductor device having an insulating substrateFUJITSU LTD·Filed 1999·Granted Dec 12, 2000·24 cites·12 claims
- 1557US5953592AMethod of fabricating semiconductor having through holeFUJITSU LTD·Filed 1998·Granted Sep 14, 1999·18 cites·8 claims
- 1649US2006226529A1Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrateFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1747US2005161794A1Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrateFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1841US9627289B2Semiconductor deviceJ-DEVICES CORP·Filed 2015·Granted Apr 18, 2017·0 cites·6 claims
- 1937US2001028101A1Method of fabricating semiconductor having through holeFUJITSU LTD·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →