Inventor · disambiguated record
Fu-Shou Tsai
Also filed as: TSAI FU-SHOU
19 granted patents·5 pending applications·30 citations·filing 2014–2024
91Inventor score
Files withUNITED MICROELECTRONICS CORP24
Top patents by PatentIndex Score
24 records- 0193US11211471B1Method of manufacturing a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 28, 2021·6 cites·7 claims
- 0289US9773682B1Method of planarizing substrate surfaceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 26, 2017·5 cites·7 claims
- 0386US11257711B1Fabricating method of transistors without dishing occurred during CMP processUNITED MICROELECTRONICS CORP·Filed 2020·Granted Feb 22, 2022·2 cites·15 claims
- 0486US9887158B1Conductive structure having an entrenched high resistive layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 6, 2018·5 cites·11 claims
- 0584US9905430B1Method for forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 27, 2018·4 cites·16 claims
- 0682US10722998B2Wafer polishing pad and using method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 28, 2020·1 cites·4 claims
- 0781US9875909B1Method for planarizing material layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 23, 2018·3 cites·18 claims
- 0874US9502303B2Method for manufacturing semiconductor device with a barrier layer having overhung portionsUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·2 cites·19 claims
- 0966US9673053B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jun 6, 2017·1 cites·3 claims
- 1066US2024170299A1Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1162US9466484B1Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 11, 2016·1 cites·20 claims
- 1260US10923481B2Semiconductor integrated circuit structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Feb 16, 2021·0 cites·7 claims
- 1359US10943910B2Method for forming semiconductor integrated circuit structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 9, 2021·0 cites·10 claims
- 1458US11923205B2Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 5, 2024·0 cites·7 claims
- 1558US10103034B2Method of planarizing substrate surfaceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·6 claims
- 1658US10049887B2Method of planarizing substrate surfaceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 14, 2018·0 cites·7 claims
- 1754US10128251B2Semiconductor integrated circuit structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Nov 13, 2018·0 cites·6 claims
- 1853US10192826B2Conductive layout structure including high resistive layerUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 29, 2019·0 cites·8 claims
- 1952US2025169079A1Method for forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2043US10734276B2Planarization methodUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 4, 2020·0 cites·17 claims
- 2142US2021273076A1Method of forming gateUNITED MICROELECTRONICS CORP·Filed 2020·Application pending·0 cites
- 2240US9972498B2Method of fabricating a gate cap layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 15, 2018·0 cites·13 claims
- 2336US2018033636A1Method of fabricating a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 2434US2017162402A1Method of manufacturing a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →