Inventor · disambiguated record
Fumitomo Watanabe
Also filed as: WATANABE FUMITOMO
17 granted patents·5 pending applications·166 citations·filing 2008–2024
92Inventor score
Files withMICRON TECHNOLOGY INC10ELPIDA MEMORY INC7KAGAYA YUTAKA2POWERTECH TECHNOLOGY INC1WATANABE MITSUHISA1
Top patents by PatentIndex Score
22 records- 0197US10217719B2Semiconductor device assemblies with molded support substratesMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 26, 2019·28 cites·16 claims
- 0293US8786102B2Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2013·Granted Jul 22, 2014·16 cites·18 claims
- 0392US8575763B2Semiconductor device and method of manufacturing the sameYOSHIDA MASANORI·Filed 2010·Granted Nov 5, 2013·14 cites·22 claims
- 0492US8076770B2Semiconductor device including a first land on the wiring substrate and a second land on the sealing portionKAGAYA YUTAKA·Filed 2008·Granted Dec 13, 2011·72 cites·9 claims
- 0591US10998290B2Semiconductor device assemblies with molded support substratesMICRON TECHNOLOGY INC·Filed 2019·Granted May 4, 2021·5 cites·20 claims
- 0684US2025006697A1Semiconductor device assemblies with molded support substratesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0783US7888179B2Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereofELPIDA MEMORY INC·Filed 2008·Granted Feb 15, 2011·12 cites·15 claims
- 0882US10453762B2Shielded fan-out packaged semiconductor device and method of manufacturingMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 22, 2019·3 cites·5 claims
- 0979US7928551B2Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2008·Granted Apr 19, 2011·13 cites·19 claims
- 1073US12119325B2Semiconductor device assemblies with molded support substratesMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 15, 2024·0 cites·18 claims
- 1169US11742252B2Shielded fan-out packaged semiconductor device and method of manufacturingMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 1269US10147705B2Stacked semiconductor die assemblies with die substrate extensionsMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 4, 2018·1 cites·8 claims
- 1365US11335667B2Stacked semiconductor die assemblies with die substrate extensionsMICRON TECHNOLOGY INC·Filed 2020·Granted May 17, 2022·0 cites·18 claims
- 1462US7993975B2Method of manufacturing semiconductor device including mounting and dicing chipsELPIDA MEMORY INC·Filed 2008·Granted Aug 9, 2011·2 cites·17 claims
- 1560US11158554B2Shielded fan-out packaged semiconductor device and method of manufacturingMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 26, 2021·0 cites·16 claims
- 1658US10553566B2Stacked semiconductor die assemblies with die substrate extensionsMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 4, 2020·0 cites·14 claims
- 1749US2009129036A1Semiconductor device and electronic deviceELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 1846US8810047B2Semiconductor device and method of manufacturing the sameWATANABE MITSUHISA·Filed 2009·Granted Aug 19, 2014·0 cites·26 claims
- 1946US2009321920A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 2045US2021296216A1Semiconductor device, lead frame, and method for manufacturing semiconductor devicePOWERTECH TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 2144US8710647B2Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring boardKAGAYA YUTAKA·Filed 2011·Granted Apr 29, 2014·0 cites·13 claims
- 2244US2009189297A1Semiconductor deviceELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →