Inventor · disambiguated record
Gary E. Dickerson
Also filed as: DICKERSON GARY · DICKERSON GARY E
11 granted patents·3 pending applications·23 citations·filing 2008–2021
84Inventor score
Files withAPPLIED MATERIALS INC8VARIAN SEMICONDUCTOR EQUIPMENT2DICKERSON GARY E1MURPHY PAUL J1VARIAN SEMICONDUCTOR EQUIPMENT ASS INC1
Top patents by PatentIndex Score
14 records- 0190US9646893B2Method and apparatus for reducing radiation induced change in semiconductor structuresAPPLIED MATERIALS INC·Filed 2016·Granted May 9, 2017·7 cites·14 claims
- 0287US9530674B2Method and system for three-dimensional (3D) structure fillYIEH ELLIE·Filed 2013·Granted Dec 27, 2016·11 cites·10 claims
- 0380US10943779B2Method and system for three-dimensional (3D) structure fillAPPLIED MATERIALS INC·Filed 2016·Granted Mar 9, 2021·2 cites·6 claims
- 0480US9620407B23D material modification for advanced processingAPPLIED MATERIALS INC·Filed 2015·Granted Apr 11, 2017·3 cites·16 claims
- 0562US11781100B2All-in-one bioreactor for therapeutic cells manufacturingAPPLIED MATERIALS INC·Filed 2020·Granted Oct 10, 2023·0 cites·19 claims
- 0657US2010098851A1Techniques for atomic layer depositionVARIAN SEMICONDUCTOR EQUIPMENT·Filed 2008·Application pending·0 cites
- 0753US12094726B2Adapting electrical, mechanical, and thermal properties of package substratesAPPLIED MATERIALS INC·Filed 2021·Granted Sep 17, 2024·0 cites·19 claims
- 0853US9773675B23D material modification for advanced processingAPPLIED MATERIALS INC·Filed 2017·Granted Sep 26, 2017·0 cites·20 claims
- 0951US10377665B2Modifying bulk properties of a glass substrateVARIAN SEMICONDUCTOR EQUIPMENT ASS INC·Filed 2016·Granted Aug 13, 2019·0 cites·14 claims
- 1051US9978620B2Method and apparatus for reducing radiation induced change in semiconductor structuresAPPLIED MATERIALS INC·Filed 2017·Granted May 22, 2018·0 cites·20 claims
- 1146US8718733B2Superconducting fault current limiter recovery systemMURPHY PAUL J·Filed 2012·Granted May 6, 2014·0 cites·16 claims
- 1246US2009200494A1Techniques for cold implantation of carbon-containing speciesVARIAN SEMICONDUCTOR EQUIPMENT·Filed 2008·Application pending·0 cites
- 1336US8487280B2Modulating implantation for improved workpiece splittingDICKERSON GARY E·Filed 2010·Granted Jul 16, 2013·0 cites·17 claims
- 1433US2015255243A1Grazing angle plasma processing for modifying a substrate surfaceAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →