Inventor · disambiguated record
Gary O. Henderson
Also filed as: HENDERSON GARY O
6 granted patents·1 pending application·314 citations·filing 1996–2005
86Inventor score
Files withMICRON TECHNOLOGY INC7
Top patents by PatentIndex Score
7 records- 0193US5679065AWafer carrier having carrier ring adapted for uniform chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 21, 1997·157 cites·10 claims
- 0291US5736427APolishing pad contour indicator for mechanical or chemical-mechanical planarizationMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 7, 1998·121 cites·46 claims
- 0390US7189333B2End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 13, 2007·15 cites·18 claims
- 0472US6852016B2End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 8, 2005·12 cites·36 claims
- 0554US6478914B1Method for attaching web-based polishing materials together on a polishing toolMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 12, 2002·5 cites·26 claims
- 0652US6557608B2Method for attaching web based polishing materials together on a polishing toolMICRON TECHNOLOGY INC·Filed 2002·Granted May 6, 2003·4 cites·9 claims
- 0750US2006025056A1End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpiecesMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →