End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces

Abstract

End effectors, apparatuses including end effectors for conditioning planarizing pads, and methods for manufacturing end effectors with contact elements to condition planarizing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector includes a member having a first surface and a plurality of generally uniformly shaped contact elements attached to the first surface. The uniformly shaped contact elements project generally transversely from the first surface. In a further aspect of this embodiment, the uniformly shaped contact elements can be conical, frusto-conical, cylindrical, or other suitable configurations. The contact elements can also have a wear-resistant, carbon-like-diamond, silicon, and/or silicon carbide layer. Furthermore, the contact elements can have generally rounded tips.

1 - 64 . (canceled)  
   
   
       65 . A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising rubbing a plurality of generally uniformly shaped contact elements of an end effector against a planarizing surface of the polishing pad, the contact elements including a plurality of first contact elements having a first height and a plurality of second contact elements having a second height different than the first height, the first and second contact elements being distributed generally uniformly across at least a portion of a surface of the end effector.  
   
   
       66 . The method of  claim 65  wherein the first and second contact elements have a generally conical configuration.  
   
   
       67 . The method of  claim 65  wherein the first and second contact elements are spaced apart from adjacent contact elements.  
   
   
       68 . The method of  claim 65  wherein the first and second contact elements have a generally cylindrical configuration.  
   
   
       69 . The method of  claim 65  wherein the first and second contact elements have a generally frusto-conical configuration.  
   
   
       70 . The method of  claim 65  wherein at least one contact element comprises a base and a wear-resistant layer over the base.  
   
   
       71 . The method of  claim 65  wherein at least one contact element comprises a base including a silicon layer.  
   
   
       72 . A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising contacting a planarizing surface of the polishing pad with a plurality of generally uniformly shaped contact elements of an end effector, the contact elements including (a) a plurality of first contact elements having a first height and arranged in a first pattern at a first region of the end effector, and (b) a plurality of second contact elements having a second height and arranged in a second pattern at a second region of the end effector, wherein the first height is different than the second height, and the first region at least partially overlaps the second region.  
   
   
       73 . The method of  claim 72  wherein the first pattern is generally the same as the second pattern.  
   
   
       74 . The method of  claim 72  wherein the first and second patterns comprise rows arranged in a grid.  
   
   
       75 . The method of  claim 72  wherein the first and second patterns comprise staggered rows.  
   
   
       76 . The method of  claim 72  wherein the first and second contact elements have a generally conical configuration.  
   
   
       77 . The method of  claim 72  wherein the first and second contact elements are spaced apart from adjacent contact elements.  
   
   
       78 . A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising abrading a planarizing surface of the polishing pad with a plurality of generally conical contact elements formed at a surface of an end effector, the contact elements including a plurality of first contact elements having a first height, and a plurality of second contact elements having a second height different than the first height.  
   
   
       79 . The method of  claim 78  wherein the first contact elements are arranged in a first pattern at a first region of the end effector, and the second contact elements are arranged in a second pattern at a second region of the end effector, and wherein the first region at least partially overlaps the second region.  
   
   
       80 . The method of  claim 78  wherein the first contact elements are arranged in a first pattern at a first region of the end effector, and the second contact elements are arranged in a second pattern at a second region of the end effector, and wherein the first and second patterns comprise rows arranged in a grid.  
   
   
       81 . The method of  claim 78  wherein the first contact elements are arranged in a first pattern at a first region of the end effector, and the second contact elements are arranged in a second pattern at a second region of the end effector, and wherein the first and second patterns comprise staggered rows.  
   
   
       82 . The method of  claim 78  wherein the first contact elements are arranged in a first pattern at a first region of the end effector, and the second contact elements are arranged in a second pattern at a second region of the end effector, and wherein the first pattern is generally the same as the second pattern.  
   
   
       83 . The method of  claim 78  wherein the first and second contact elements are spaced apart from adjacent contact elements.  
   
   
       84 . The method of  claim 78  wherein the first and second contact elements have a generally frusto-conical configuration.