Inventor · disambiguated record
Gary Lafontant
Also filed as: LAFONTANT GARY
9 granted patents·1 pending application·31 citations·filing 2005–2013
85Inventor score
Top patents by PatentIndex Score
10 records- 0181US7271681B2Clearance hole size adjustment for impedance control in multilayer electronic packaging and printed circuit boardsIBM·Filed 2005·Granted Sep 18, 2007·12 cites·11 claims
- 0276US8298929B2Offset solder vias, methods of manufacturing and design structuresDAUBENSPECK TIMOTHY H·Filed 2010·Granted Oct 30, 2012·4 cites·6 claims
- 0375US9040418B2Enhanced capture pads for through semiconductor viasIBM·Filed 2013·Granted May 26, 2015·3 cites·19 claims
- 0473US8237288B1Enhanced electromigration resistance in TSV structure and designFAROOQ MUKTA G·Filed 2011·Granted Aug 7, 2012·3 cites·7 claims
- 0569US8772949B2Enhanced capture pads for through semiconductor viasIBM·Filed 2012·Granted Jul 8, 2014·2 cites·15 claims
- 0669US8288270B2Enhanced electromigration resistance in TSV structure and designFAROOQ MUKTA G·Filed 2012·Granted Oct 16, 2012·2 cites·7 claims
- 0764US8674506B2Structures and methods to reduce maximum current density in a solder ballIBM·Filed 2013·Granted Mar 18, 2014·1 cites·13 claims
- 0863US8446006B2Structures and methods to reduce maximum current density in a solder ballBEZAMA RASCHID J·Filed 2009·Granted May 21, 2013·2 cites·22 claims
- 0960US8487447B2Semiconductor structure having offset passivation to reduce electromigrationINTERRANTE MARIO J·Filed 2011·Granted Jul 16, 2013·2 cites·16 claims
- 1037US2011206379A1Opto-electronic module with improved low power, high speed electrical signal integrityIBM·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →