Inventor · disambiguated record
Gang-Yi Lin
Also filed as: LIN GANG · LIN GANG-YI
27 granted patents·4 pending applications·126 citations·filing 1995–2024
93Inventor score
Files withUNITED MICROELECTRONICS CORP11FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD9AU OPTRONICS CORP5QUALCOMM INC2KAWASAKI HEAVY IND LTD1
Top patents by PatentIndex Score
31 records- 0191US10312088B1Self-aligned double patterning methodUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 4, 2019·7 cites·10 claims
- 0291US9678395B1Array substrate and curved liquid crystal display panelAU OPTRONICS CORP·Filed 2016·Granted Jun 13, 2017·5 cites·20 claims
- 0385US11903181B2Semiconductor structure and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Feb 13, 2024·1 cites·14 claims
- 0485US7155178B2Circuit system for wireless communicationsMEDIATEK INC·Filed 2004·Granted Dec 26, 2006·41 cites·20 claims
- 0580US12396152B2Semiconductor structure and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 0680US9599870B2Display panel and curved displayAU OPTRONICS CORP·Filed 2015·Granted Mar 21, 2017·2 cites·30 claims
- 0778US10795255B2Method of forming layout definition of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 6, 2020·2 cites·14 claims
- 0878US5591896ASolid-state gas sensorsFiled 1995·Granted Jan 7, 1997·65 cites·20 claims
- 0972US12381082B2Semiconductor structure, method for fabricating thereof, and method for fabricating semiconductor layoutFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·10 claims
- 1071US10700071B1Method for forming semiconductor patternUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 30, 2020·1 cites·16 claims
- 1169US11996290B2Semiconductor structure, method for fabricating thereof, and method for fabricating semiconductor layoutFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted May 28, 2024·0 cites·10 claims
- 1268US10879169B2Integrated inductors for power management circuitsQUALCOMM INC·Filed 2018·Granted Dec 29, 2020·1 cites·13 claims
- 1368US9989817B2Pixel structureAU OPTRONICS CORP·Filed 2017·Granted Jun 5, 2018·1 cites·16 claims
- 1467US12484210B2Semiconductor structure and method for forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·19 claims
- 1567US11545547B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 3, 2023·0 cites·11 claims
- 1657US11758710B2Memory device and fabrication method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 1757US11038014B2Semiconductor device having plug and metal lineUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 15, 2021·0 cites·7 claims
- 1854US11482424B2Active region structure and the forming method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·6 claims
- 1953US12068316B2Semiconductor device and method of forming the sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·8 claims
- 2052US2022359534A1Active region structure and the forming method thereofFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2022·Application pending·0 cites
- 2150US10734284B2Method of self-aligned double patterningUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 4, 2020·0 cites·7 claims
- 2250US10672612B2Method of forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 2, 2020·0 cites·14 claims
- 2350US10658178B2Patterning method utilizing dummy mandrelUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 19, 2020·0 cites·15 claims
- 2448US10018053B2Turbine blade cooling structureKAWASAKI HEAVY IND LTD·Filed 2015·Granted Jul 10, 2018·0 cites·5 claims
- 2548US9116576B2Photosensitive pixel circuit of touch moduleAU OPTRONICS CORP·Filed 2014·Granted Aug 25, 2015·0 cites·11 claims
- 2647US10475662B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·0 cites·10 claims
- 2745US10535530B2Patterning methodUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 14, 2020·0 cites·18 claims
- 2843US10332477B2Display device and driving method thereofAU OPTRONICS CORP·Filed 2016·Granted Jun 25, 2019·0 cites·8 claims
- 2942US2021351192A1One-time programmable device with antifuseQUALCOMM INC·Filed 2020·Application pending·0 cites
- 3040US2019304777A1Method for forming hard maskUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 3132US2002066317A1Micro yaw rate sensorsFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →