Inventor · disambiguated record
Gang Liu
Also filed as: LIU GANG · LIU GANG L
9 granted patents·4 pending applications·50 citations·filing 2016–2022
85Inventor score
Files withLAM RES CORP13
Top patents by PatentIndex Score
13 records- 0196US11365479B2Ex situ coating of chamber components for semiconductor processingLAM RES CORP·Filed 2020·Granted Jun 21, 2022·8 cites·16 claims
- 0295US10211099B2Chamber conditioning for remote plasma processLAM RES CORP·Filed 2016·Granted Feb 19, 2019·24 cites·21 claims
- 0394US12227837B2Ex situ coating of chamber components for semiconductor processingLAM RES CORP·Filed 2022·Granted Feb 18, 2025·2 cites·19 claims
- 0494US10760158B2Ex situ coating of chamber components for semiconductor processingLAM RES CORP·Filed 2018·Granted Sep 1, 2020·14 cites·23 claims
- 0587US12261081B2Tungsten feature fill with inhibition controlLAM RES CORP·Filed 2020·Granted Mar 25, 2025·2 cites·10 claims
- 0679US12163219B2Ex situ coating of chamber components for semiconductor processingLAM RES CORP·Filed 2022·Granted Dec 10, 2024·0 cites·19 claims
- 0769US12448686B2Reducing line bending during metal fill processLAM RES CORP·Filed 2022·Granted Oct 21, 2025·0 cites·21 claims
- 0859US12476143B2Backside reactive inhibition gasLAM RES CORP·Filed 2021·Granted Nov 18, 2025·0 cites·13 claims
- 0956US2025038050A1Feature fill with nucleation inhibitionLAM RES CORP·Filed 2022·Application pending·0 cites
- 1054US2025014938A1Edge rings for improved edged uniformity in semiconductor processing operationsLAM RES CORP·Filed 2022·Application pending·0 cites
- 1153US2024376598A1Process gas ramp during semiconductor processingLAM RES CORP·Filed 2022·Application pending·0 cites
- 1247US2023122846A1Feature fill with nucleation inhibitionLAM RES CORP·Filed 2021·Application pending·0 cites
- 1344US12394608B2Cleaning system for removing deposits from pump in an exhaust of a substrate processing systemLAM RES CORP·Filed 2019·Granted Aug 19, 2025·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →