Inventor · disambiguated record
Gary L. Milo
Also filed as: MILO GARY · MILO GARY L
15 granted patents·5 pending applications·80 citations·filing 1999–2016
90Inventor score
Top patents by PatentIndex Score
20 records- 0195US8604618B2Structure and method for reducing vertical crack propagationCOONEY III EDWARD C·Filed 2011·Granted Dec 10, 2013·24 cites·21 claims
- 0282US9059233B2Formation of an asymmetric trench in a semiconductor substrate and a bipolar semiconductor device having an asymmetric trench isolation regionIBM·Filed 2013·Granted Jun 16, 2015·4 cites·16 claims
- 0377US9231089B2Formation of an asymmetric trench in a semiconductor substrate and a bipolar semiconductor device having an asymmetric trench isolation regionIBM·Filed 2015·Granted Jan 5, 2016·2 cites·20 claims
- 0476US9548349B2Semiconductor device with metal extrusion formationIBM·Filed 2014·Granted Jan 17, 2017·2 cites·11 claims
- 0571US6699400B1Etch process and apparatus thereforFiled 1999·Granted Mar 2, 2004·31 cites·14 claims
- 0665US7332054B2Etch apparatusIBM·Filed 2004·Granted Feb 19, 2008·8 cites·12 claims
- 0757US9825119B2Semiconductor device with metal extrusion formationIBM·Filed 2016·Granted Nov 21, 2017·0 cites·11 claims
- 0857US9825120B2Semiconductor device with metal extrusion formationIBM·Filed 2016·Granted Nov 21, 2017·0 cites·8 claims
- 0957US6576507B1Selectively removable filler layer for BiCMOS processIBM·Filed 2000·Granted Jun 10, 2003·9 cites·19 claims
- 1054US9435948B2Silicon waveguide structure with arbitrary geometry on bulk silicon substrate, related systems and program productsGLOBALFOUNDRIES INC·Filed 2014·Granted Sep 6, 2016·0 cites·19 claims
- 1152US9059258B2Controlled metal extrusion opening in semiconductor structure and method of formingIBM·Filed 2013·Granted Jun 16, 2015·0 cites·14 claims
- 1252US2008066864A1Etch apparatusBALLANTINE ARNE W·Filed 2007·Application pending·0 cites
- 1351US9484301B2Controlled metal extrusion opening in semiconductor structure and method of formingGLOBALFOUNDRIES INC·Filed 2015·Granted Nov 1, 2016·0 cites·2 claims
- 1450US2013171817A1Structure and method for reducing vertical crack propagationIBM·Filed 2013·Application pending·0 cites
- 1548US9196592B2Methods of managing metal density in dicing channel and related integrated circuit structuresIBM·Filed 2014·Granted Nov 24, 2015·0 cites·14 claims
- 1643US10056306B2Test structure for monitoring interface delaminationGLOBALFOUNDRIES INC·Filed 2016·Granted Aug 21, 2018·0 cites·20 claims
- 1741US9577023B2Metal wires of a stacked inductorGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 21, 2017·0 cites·14 claims
- 1841US2003037141A1Heuristic profiler software featuresFiled 2002·Application pending·0 cites
- 1940US2003037260A1Heuristic profiler for packet screeningFiled 2001·Application pending·0 cites
- 2039US2012319237A1Corner-rounded structures and methods of manufactureCOONEY III EDWARD C·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →